Curable Thermally Conductive Composition for High Extrusion Rate
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Solution Overview
Problem
There is a challenge in developing thermally conductive interface materials that simultaneously achieve high thermal conductivity and high extrusion rates, while maintaining a suitable consistency for precise application on small electronic components.
Innovation Solution
A curable thermally conductive composition comprising 94 to 97 weight-percent of thermally conductive fillers, including 30 to less than 55 weight-percent of aluminum particles with a D50 particle size in the range of 60 to 150 micrometers, along with an alkenyl-functional polyorganosiloxane and a silyl-hydride functional polysiloxane crosslinker, which cures to achieve a thermal conductivity of at least 10 Watts per meter*Kelvin and an extrusion rate of 40 grams per minute or more.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the amount of thermally conductive fillers is increased to improve thermal conductivity, then thermal conductivity increases, but extrusion rate decreases and the composition becomes a powdery paste
Solution Approach 1:
The patent applies parameter changes by carefully controlling the particle size distribution parameters of the fillers (D10, D50, D90 values) and the viscosity parameter of the polysiloxane matrix. By optimizing these parameters within specific ranges, the composition achieves both high thermal conductivity (≥10 W/m·K) and adequate extrusion rate (≥40 g/min), resolving the contradiction between thermal performance and processability.
Solution Approach 2:
The patent uses composite materials by combining multiple filler types (aluminum particles, aluminum oxide particles, aluminum nitride particles) with different thermal conductivities and size distributions. This multi-component filler system, integrated with the polysiloxane matrix, creates a composite that simultaneously achieves high thermal conductivity and maintainable extrusion characteristics.
2Temperature
If the amount of thermally conductive fillers is increased to achieve high thermal conductivity, then thermal conductivity improves, but the composition consistency deteriorates becoming too thick for precise application
Solution Approach 1:
The patent controls the viscosity parameter of the polysiloxane matrix within a specific range (25 to 2000 cP at 25°C) and optimizes the particle size distribution parameters of fillers. These parameter adjustments ensure the composition remains extrudable with consistent flow characteristics even at 94-97 wt% total filler content, enabling precise application on small electronic components.
Solution Approach 2:
The patent applies local quality by using a broad particle size distribution where different sized particles fulfill different functions: larger particles (D50: 60-150 μm) provide thermal conductivity, while smaller particles (D50: 1-10 μm and D50: 0.1-1 μm) fill voids and modify rheology. This creates local optimization within the composite structure that maintains both thermal performance and extrusion consistency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition effectively balances thermal conductivity and extrusion rate, enabling efficient heat dissipation in small, high-power electronic devices while maintaining the ability to be precisely applied.
Implementation Method 1
a curable thermally conductive composition that contains 94 to 97 weight-percent (wt %) of thermally conductive fillers... comprising: (A) from 1.0 to 4.0 weight-percent of an alkenyl-functional polyorganosiloxane... (B) a silyl-hydride functional polysiloxane crosslinker
Implementation Method 2
Thermally conductive interface materials are often used in electronics to thermally couple heat generating components and heat dissipating components... that cures to a material that has a thermal conductivity of at least 10 Watts per meter*Kelvin
Data Source
AI summary
A curable thermally conductive composition contains: (A) an alkenyl-functional polyorganosiloxane having a viscosity in a range of 25 to 2000 millipascal*seconds; (B) a silyl-hydride functional polysiloxane crosslinker; (C) from 94 to 97 weight-percent of thermally conductive fillers that contain (c1) from 30 to less than 55 weight-percent of aluminum particles having a D50 of 60 micrometers or more; (c2) from 20 to 40 weight-percent of thermally conductive fillers having a D50 of 1 to 10 micrometers; (c3) from 8 to 20 weight-percent of thermally conductive fillers having a D50 of 0.1 to less than 1 micrometer; and (c4) optionally, from zero to 20 weight-percent of thermally conductive fillers other than (c1), having a D50 of 20 to 80 micrometers; and (D) from 0.1 to 2.5 weight-percent of a filler treating agent comprising a trialkoxysilyl diorganopolysiloxane, and optionally, an alkyl trialkoxysilane; where weight-percentages are relative to curable thermally conductive composition weight.