Cured Epoxy Enclosure Composition for Thermal Conductivity and Flexibility
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Solution Overview
Problem
Existing electronic device enclosures made of conventional materials face challenges in balancing thermal conductivity and mechanical properties, particularly in maintaining thermal conductivity while ensuring flexibility and impact resistance.
Innovation Solution
A cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles, combined with epoxy resin and oligomeric or polymeric moieties with a glass transition temperature less than 0°C, to enhance thermal conductivity and mechanical properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If conventional materials are used for electronic device enclosures, then ease of manufacture is maintained, but thermal conductivity is insufficient
Solution Approach 1:
The patent employs composite materials by combining epoxy resin with thermally conductive inorganic particles (such as aluminum oxide, aluminum nitride, or boron nitride) to create an enclosure material that achieves high thermal conductivity while maintaining ease of manufacture through conventional molding processes
2Temperature
If high volume percentage of inorganic particles is used, then thermal conductivity is improved, but mechanical properties deteriorate
Solution Approach 1:
The patent optimizes the volume percentage of thermally conductive inorganic particles within a specific range (50-90 vol%) and controls particle size distribution to balance thermal conductivity enhancement with maintenance of mechanical strength and flexibility
Solution Approach 2:
The patent uses surface treatment on inorganic particles to improve local interfacial bonding quality between particles and epoxy resin matrix, thereby maintaining mechanical strength despite high particle loading
3Temperature
If high volume percentage of inorganic particles is used, then thermal conductivity is improved, but flexibility deteriorates
Solution Approach 1:
The patent controls the volume percentage of inorganic particles and incorporates oligomeric or polymeric moieties with glass transition temperature less than 0°C to maintain flexibility while achieving high thermal conductivity
4Temperature
If high volume percentage of inorganic particles is used, then thermal conductivity is improved, but impact resistance deteriorates
Solution Approach 1:
The patent optimizes particle concentration and size distribution, and uses specific epoxy resin formulations with controlled glass transition temperatures to maintain impact resistance while achieving high thermal conductivity
Solution Approach 2:
The patent employs surface treatment on inorganic particles to improve local interfacial bonding, preventing particle-matrix debonding under impact conditions and maintaining overall impact resistance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition achieves high thermal conductivity (up to 1.2 W/m*K) and mechanical strength, with flexibility and impact resistance, suitable for electronic device enclosures.
Implementation Method 1
at least 50 volume % of electrically non-conductive thermally conductive inorganic particles
Implementation Method 2
epoxy reactive oligomeric or polymeric moieties having a glass transition temperature less than 0° C.
Data Source
AI summary
An electronic device is described comprising an enclosure, wherein the enclosure comprises a cured epoxy resin composition comprising at least 50 volume % of electrically non-conductive thermally conductive inorganic particles. The enclosure may be a housing of a phone, laptop, or mouse. Alternatively, the enclosure may be a case for an electronic device. Also described are epoxy resin compositions and a method of making an enclosure for an electronic device.