Cured Solder Particle Classification to Prevent Sieve Clogging
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current solder particle manufacturing methods using swirling airflow sifters result in deformation of solder particles upon collision with the sieve, leading to adherence and clogging, which decreases productivity and increases the risk of short-circuiting.
Innovation Solution
A solder particle manufacturing method involving a curing step to achieve a hardness of 850 N/mm2 or greater and 1,500 N/mm2 or less under compressive deformation, followed by classification using a swirling airflow sifter, which inhibits particle deformation and adherence to the sieve.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder particles are classified using a swirling airflow sifter, then coarse solder particles can be removed to avoid short-circuiting, but the solder particles deform and adhere to the sieve causing productivity decrease
Solution Approach 1:
The solder particles are cured before classification to increase their hardness. This preliminary hardening action prevents deformation during the subsequent classification process, allowing particles to be separated without adhering to the sieve, thus maintaining high productivity while achieving reliable particle separation
Solution Approach 2:
The hardness parameter of the solder particles is changed through curing treatment. By adjusting the hardness to a specific range (850-1500 N/mm²), the particles become resistant to deformation during classification, preventing adhesion to the sieve and maintaining classification efficiency while ensuring coarse particle removal
2Shape
If the hardness of solder particles is increased to prevent deformation, then particle integrity is maintained during classification, but the curing process complexity increases
Solution Approach 1:
The hardness of the solder particles is adjusted to a specific range (850-1500 N/mm²) through controlled curing. This parameter optimization ensures particles are hard enough to resist deformation during classification but not so hard as to require overly complex curing equipment or processes
Solution Approach 2:
The curing process replaces mechanical particle strengthening methods with a chemical/thermal treatment approach. This substitution simplifies the overall process by using a straightforward heat treatment to achieve the desired hardness, avoiding complex mechanical reinforcement systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method enhances productivity by improving yield and prevents short-circuiting by effectively removing coarse solder particles, ensuring the solder particles do not deform and adhere to the sieve during classification.
Implementation Method 1
heating is performed in an oxygen-containing atmosphere at a temperature lower than or equal to (a melting point of the solder particles—15° C.)
Implementation Method 2
a classifying step of classifying the solder particles after being cured by forcibly generating an airflow using a classifying device
Data Source
AI summary
A solder particle manufacturing method includes a curing step of curing solder particles such that a hardness K of the solder particles under compressive deformation to 70% is 850 N/mm2 or greater and 1,500 N/mm2 or less, and a classifying step of classifying the solder particles after being cured by forcibly generating an airflow using a classifying device.