Curing Agent Particles Coated With Alkoxy Oligomer
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Epoxy resin compositions with solid curing agents face issues with aggregation and reduced latency due to acid anhydride and solvent exposure, leading to increased viscosity and loss of handling properties.
Innovation Solution
Coating curing agent particles for epoxy resin with an alkoxy oligomer improves acid anhydride resistance and solvent resistance, preventing aggregation and maintaining latency by forming a stable surface layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a solid curing agent for epoxy resin is used, then latency can be achieved, but aggregation occurs and acid anhydride/solvent resistance is poor
Solution Approach 1:
A silane coupling agent is introduced as an intermediary substance between the solid curing agent particles and the epoxy resin composition. The silane coupling agent forms a coating layer on the particle surfaces, preventing direct contact between particles (reducing aggregation) and providing a protective barrier against acid anhydrides and solvents, while still allowing the curing agent to function when activated by heat.
Solution Approach 2:
The invention creates a composite structure where solid curing agent particles are combined with a silane coupling agent coating. This composite material approach allows the curing agent to maintain its solid particulate form for latency while the silane coating provides enhanced resistance properties. The composite particles exhibit improved performance characteristics that neither component alone could provide.
2Object-affected harmful factors
If the curing agent is treated with a silane coupling agent, then acid anhydride resistance and solvent resistance improve, but aggregation still occurs
Solution Approach 1:
The invention optimizes specific parameters including the silane coupling agent content (0.1-10 mass% relative to curing agent), particle size distribution (average 1-10 μm), and surface treatment conditions. By carefully controlling these parameters, the coating provides sufficient protection against aggregation while maintaining acid anhydride and solvent resistance. The specific parameter ranges identified in the invention represent the optimal balance between these competing requirements.
3Object-affected harmful factors
If dry treatment method is used, then solvent resistance improves, but aggregation occurs in solid curing agent
Solution Approach 1:
The silane coupling agent treatment is performed as a preliminary action before the curing agent is incorporated into the epoxy resin composition. This pre-coating establishes a protective layer that prevents aggregation from occurring in the first place, rather than attempting to prevent aggregation after it has formed. The preliminary surface modification ensures particles remain dispersed and stable throughout storage and processing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The coated particles exhibit reduced aggregation, enhanced acid anhydride resistance, and solvent resistance, maintaining the epoxy resin composition's stability and handling properties even in the presence of acid anhydride and solvents.
Implementation Method 1
treating a curing agent with a silane coupling agent such as γ-glycidoxypropyltrimethoxysilane
Implementation Method 2
a silane coupling agent such as γ-glycidoxypropyltrimethoxysilane
Data Source
AI summary
An object of the present invention is to provide curing agent composite particles for epoxy resin, which are less likely to aggregate, and are excellent in storage stability and solvent resistance. Coated particles of the present invention comprise (A) curing agent particles for epoxy resin, and (B) an alkoxy oligomer, wherein the surfaces of the curing agents for epoxy resin particle are coated with the alkoxy oligomer.


