Curing Reactive Silicone Composition for Low-Temperature Adhesion
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Solution Overview
Problem
Existing silicone materials used in pressure sensitive adhesive applications face challenges with low adhesion in both uncured and cured states, particularly when formed on substrates that cannot be heated to high temperatures.
Innovation Solution
A curing reactive silicone composition is developed, comprising an organopolysiloxane resin, a straight chain or branched organopolysiloxane with aliphatic unsaturated carbon-carbon bonds, an organohydrogenpolysiloxane, and a high energy beam activation catalyst. This composition is non-fluid at 25°C, heat meltable, and can be quickly cured with high energy irradiation to achieve high adhesive strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a high energy beam activation catalyst is used to enable curing at low temperatures, then the substrate can be cured without high temperature heating, but the adhesion to adherend in uncured state becomes low
Solution Approach 1:
The composition is divided into multiple functional components: (A) organopolysiloxane resin providing base properties and heat meltability, (B) straight chain or branched organopolysiloxane with aliphatic unsaturated carbon-carbon bonds providing curing reactivity, (C) organohydrogenpolysiloxane providing hydrogen atoms for crosslinking, and (D) high energy beam activation catalyst. This segmentation allows each component to contribute specific properties, enabling the composition to achieve both heat meltability and adequate uncured adhesion while remaining curable at low temperatures.
Solution Approach 2:
The invention uses a composite silicone composition combining multiple polysiloxane types with different molecular structures and reactivities. The composite nature allows the material to exhibit both thermal processability (from the organopolysiloxane resin) and chemical curing capability (from the hydrosilylation components), resolving the contradiction between low-temperature curing and uncured adhesion by having different components serve different functions.
2Temperature
If a light activated catalyst is used for curing, then the substrate can be cured at room temperature, but the adhesion to adherend in cured state becomes low
Solution Approach 1:
The invention changes the chemical parameters of the silicone composition by incorporating specific organopolysiloxane resins with controlled molecular weight and structure, along with hydrosilylation components. This parameter adjustment enables the composition to achieve strong intermolecular forces and crosslinking density that provide high cured adhesion while maintaining compatibility with low-temperature curing processes.
3Stability of the object's composition
If the composition is made non-fluid at 25°C for structural stability, then the material maintains shape, but the moldability and gap fillability are reduced
Solution Approach 1:
The composition exhibits dynamic rheological properties where it transitions from a non-fluid state at room temperature to a fluid state upon heating. This dynamic behavior allows the material to maintain structural stability during storage and handling while achieving excellent moldability and gap fillability when heated during the molding process, effectively resolving the contradiction between stability and manufacturability.
Solution Approach 2:
The invention utilizes phase transition from solid-like to liquid-like state through heating. The composition remains non-fluid at 25°C for stability but becomes moldable when heated above its softening point, allowing it to flow into molds and fill gaps during processing, then solidifies upon cooling or curing. This phase transition enables both structural stability and ease of manufacture at different stages of the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curing reactive silicone composition achieves sufficient toughness and pressure sensitive adhesive strength for temporary securing of substrates, with excellent moldability and gap fillability. The composition can be easily molded into sheets or other forms and exhibits high adhesive strength after curing, even after crimping.
Implementation Method 1
a hydrosilylation reaction catalyst that does not exhibit activity without irradiating with a high energy beam, but exhibits activity in a composition by irradiating a high energy beam
Implementation Method 2
Silicone materials are usually obtained by crosslinking an organopolysiloxane by a hydrosilylation reaction
Data Source
AI summary
Provided is: a curing reactive silicone composition having sufficient toughness and pressure sensitive adhesive strength to temporarily secure various substrate even in an uncured state, having heat meltability and excellent moldability of a sheet or the like, and that can be quickly cured by high energy irradiation to achieve high adhesive strength; a method of manufacturing a sheet thereof a cured product thereof that can achieve high adhesive strength by crimping; and applications thereof. The curing reactive silicone composition comprises: (A) an MQ resin; (B) a chain organopolysiloxane having at least two groups containing an aliphatic unsaturated carbon-carbon bond, and a degree of siloxane polymerization within a range of 80 to 3000; (C) an organohydrogenpolysiloxane; and (D) a hydrosilylation reaction catalyst activated by a high energy beam. The amount of component (A) is more than 55 mass % and less than 90 mass % of the sum of components (A) to (C).