Current Sensing Resistor With Auxiliary Layer For Precision

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Current sensing resistors face challenges in maintaining high resistance precision due to resistance deviations caused by the application of a soldering layer, which results in inconsistent resistance values across a batch of resistors.

Innovation Solution

The design includes a resistor plate with an electrode structure and an auxiliary layer, where the electrode layer is disposed on one face and the auxiliary layer on the opposite face, separated to prevent undesired current flows, and a soldering layer is applied over both, with a protective layer filling gaps to maintain structural integrity and prevent warping.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a soldering layer is applied to the resistor after resistance measurement and adjustment, then the resistor can be mounted on a PCB, but the resistance deviation increases due to the soldering layer

Engineering Contradiction:
Improvemounting capabilityVSAvoidresistance precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The patent applies preliminary action by performing resistance measurement and adjustment on the resistor plate before applying the soldering layer. This ensures that the resistance is calibrated to the target value before the soldering process, which would otherwise introduce resistance deviations. The resistor plate is measured and adjusted, then the soldering layer is applied, and finally the assembled component is measured again to confirm the resistance remains within specifications.

Inventive Principle:
Principle #10Preliminary action

2Manufacturing precision

If repetitive measurement and adjustment are performed to achieve high resistance precision, then the resistance deviation is reduced, but the manufacturing process complexity increases

Engineering Contradiction:
Improveresistance precisionVSAvoidmanufacturing process complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent performs resistance measurement and adjustment as a preliminary action before applying the soldering layer. This preliminary calibration ensures that the resistor plate is properly adjusted before the soldering process introduces potential deviations. By measuring and adjusting early, the need for extensive repetitive adjustments after soldering is reduced.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements feedback by measuring the resistance of the resistor plate, comparing it to the target value, and making adjustments based on the measured deviation. This feedback loop continues until the resistance is within the desired tolerance range. The process includes initial measurement, adjustment, soldering, and final measurement to ensure the resistance remains within specifications.

Inventive Principle:
Principle #23Feedback

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration ensures consistent resistance before and after the soldering layer is applied, minimizing deviations and achieving the required high resistance precision by blocking undesired current flows and maintaining structural stability.

Implementation Method 1

the newly produced resistor is then performed with a barrel plating process to be electroplated with a soldering layer for facilitating the mounting of the resistor onto a printed circuit board (PCB)

Methodology Applied
Scientific EffectElectroplating: Electroplating

Data Source

PatentUS8779887B2Current sensing resistor
Publication Date: 2014.07.15 CYNTEC
  • US8779887B2 patent drawing
  • US8779887B2 patent drawing
  • US8779887B2 patent drawing

AI summary

A resistor device includes a resistor plate and an electrode structure. The electrode structure includes an electrode layer and an auxiliary layer. The electrode layer is disposed at a first face of the resistor plate and includes a first portion and a second portion overlying a first side and a second side of the resistor plate, respectively, and a current path is conducted between the first portion and the second portion through the resistor plate. The auxiliary layer is disposed at a second face of the resistor plate and includes at least a first block and a second block overlying the first side of the resistor plate, and at least a third block overlying the second side of the resistor plate, wherein the first, second and third blocks of the auxiliary layer are separated from one another so that any current flow among the blocks is blocked.