Current Sensor Manufacturing Adhesive Deformation
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Solution Overview
Problem
Current sensors face challenges in achieving high productivity suitable for mass production while maintaining high accuracy in detection performance, particularly in the positional relationships of the wiring board and the shield relative to the bus bar.
Innovation Solution
A method for manufacturing a current sensor that involves preparing a sensor housing, a wiring board, and a shield, and then placing the wiring board and shield into contact with specific portions of the sensor housing while deforming an adhesive applied on top surfaces of adhesion portions. This ensures accurate positioning and simultaneous curing of the adhesive after both components are placed.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional manufacturing methods are used for current sensors, then the process is simpler, but productivity is insufficient for mass production while maintaining high accuracy in positional relationships
Solution Approach 1:
The sensor housing is prepared in advance with pre-formed adhesion portions (protrusions) that will later receive the wiring board and shield. This preliminary preparation of the housing structure enables efficient mass production while ensuring precise positioning of components during assembly
Solution Approach 2:
An adhesive is introduced as an intermediary substance between the adhesion portions of the sensor housing and the components (wiring board and shield). The adhesive fills the spaces around the protrusions and cures to form strong bonds, achieving both high productivity through simplified assembly and high positioning accuracy through the intermediary adhesive layer
2Productivity
If multiple components are assembled separately, then positioning accuracy can be maintained, but production time increases and productivity decreases
Solution Approach 1:
The wiring board and shield are assembled simultaneously into the sensor housing in a single operation. The housing's adhesion portions are pre-configured to receive both components at the same time, allowing parallel assembly that increases productivity while maintaining positioning accuracy through the structured adhesion portions
Solution Approach 2:
The adhesion portions with protrusions automatically guide and position the wiring board and shield during assembly. The physical structure of the protrusions provides self-aligning features that ensure accurate positioning without requiring complex external positioning mechanisms or multiple adjustment steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method achieves a high degree of productivity suitable for mass production while maintaining high accuracy in the positional relationships of the components, thereby enhancing the detection performance of the current sensor.
Implementation Method 1
placing the wiring board by bringing the wiring board into contact with a plurality of board contact portions of the sensor housing while deforming an adhesive applied on a plurality of top surfaces of board adhesion portions of the sensor housing between the top surfaces of the board adhesion portions and the wiring board
Data Source
AI summary
In a method for manufacturing a current sensor, a wiring board is placed by bringing the wiring board into contact with board contact portions of a sensor housing while deforming an adhesive applied on top surfaces of board adhesion portions of the sensor housing between the board adhesion portions and the wiring board, and a shield is placed by bringing the shield into contact with shield contact portions of the sensor housing while deforming an adhesive applied on top surfaces of shield adhesion portions of the sensor housing between the shield adhesion portions and the shield. After the placing of the wiring board and the placing of the shield, both the adhesive positioned between the board adhesion portions and the wiring board and the adhesive positioned between the shield adhesion portions and the shield are cured simultaneously.