Current Sensor Package With Continuous Encapsulant Insulation
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Solution Overview
Problem
Current sensor packages face challenges in achieving high reliability and safety insulation, especially in low and mid-voltage regions, where standard semiconductor package technology struggles to provide reliable galvanic insulation without increasing costs, and internal interfaces can lead to delamination and leakage currents.
Innovation Solution
A current sensor package design featuring a continuous encapsulant extending between the current path and the sensing device, avoiding internal interfaces to ensure delamination-resistant insulation, and using a leadframe as a carrier for cost-efficiency and thermal conductivity, with the encapsulant also covering the conductive trace to maintain electrical isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple layers of insulating tape are used to achieve reinforced insulation, then electrical insulation reliability is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent combines multiple insulation functions into a single encapsulant structure that provides both mechanical protection and electrical insulation. The encapsulant integrates the functions previously requiring separate insulating tape layers, thereby reducing structural complexity while maintaining insulation reliability through continuous material coverage and optimized design.
2Ease of manufacture
If internal interfaces are present in the insulation structure, then manufacturing ease is improved, but reliability deteriorates due to delamination and leakage currents
Solution Approach 1:
The patent eliminates internal interfaces from the insulation structure by using a monolithic encapsulant design. This removes the problematic boundaries between layers where delamination and leakage could occur, while the encapsulant can still be manufactured using standard processes without requiring complex multi-layer assembly.
3Ease of manufacture
If standard semiconductor package technology is used for galvanic insulation, then manufacturing cost is reduced, but insulation reliability is insufficient in low and mid-voltage regions
Solution Approach 1:
The patent modifies the insulation design parameters by optimizing the encapsulant geometry, material selection, and thickness to achieve reinforced insulation suitable for low and mid-voltage applications. This allows standard manufacturing processes to be used while meeting higher reliability requirements through carefully controlled design parameters rather than complex multi-layer structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the reliability and safety of the current sensor package by preventing internal interface-related issues, ensuring robust electrical insulation and reducing costs through a single-layer insulation approach, thereby improving long-term insulation integrity and protection against voltage transients.
Implementation Method 1
a sensing device (e.g. a sensor chip), the sensing device being spaced from the current path, and the sensing device being configured for sensing a magnetic field generated by a current flowing through the current path
Implementation Method 2
an encapsulant extending continuously between the current path and the sensing device
Data Source
AI summary
A current sensor package, comprises a current path and a sensing device. The sensing device is spaced from the current path, and the sensing device is configured for sensing a magnetic field generated by a current flowing through the current path. Further, the sensing device comprises a sensor element. The sensing device is electrically connected to a conductive trace. An encapsulant extends continuously between the current path and the sensing device.