Current Sensor Cooling via Thermal Interface
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Solution Overview
Problem
Inverters and converters with integrated current transducers face thermal loading issues due to heat convection and conduction from heat-generating components, limiting their operational temperature range.
Innovation Solution
An electrical unit with a heat-conducting housing that incorporates a current transducer with a ferric core and a thermal interface member made of dielectric material, allowing for efficient heat dissipation to the housing and ambient air, thereby reducing thermal impedance and maintaining lower temperatures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If the current transducer is placed within the same enclosure as heat-generating components, then integration and space utilization are improved, but thermal loading and operational temperature range are worsened
Solution Approach 1:
A thermal interface member (heat sink) is introduced as an intermediary between the current transducer and the enclosure. This heat sink conducts heat away from the current transducer to the enclosure walls, allowing the transducer to operate at lower temperatures while maintaining integration within the same enclosure.
Solution Approach 2:
The heat dissipation function is extracted from the enclosure structure itself and assigned to a dedicated thermal interface member. This allows the enclosure to maintain its integrated design while the specialized cooling component handles the thermal management separately.
2Temperature
If heat dissipation structures are added to the current transducer, then thermal management is improved, but device complexity and space requirements are worsened
Solution Approach 1:
The thermal interface member serves multiple functions: it acts as a heat sink for thermal management, provides mechanical support for mounting the current transducer, and can serve as a structural element of the enclosure. This multi-functionality reduces the need for separate dedicated cooling structures.
Solution Approach 2:
The cooling function is merged with the mounting structure and enclosure design. The thermal interface member is integrated into the existing structural framework of the device, combining thermal management with mechanical support functions in a single component.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages thermal energy dissipation, enhancing the operational temperature range and reliability of electrical devices by creating a low thermal impedance path for heat removal from the current transducer.
Implementation Method 1
a thermal interface member made of dielectric material, allowing for efficient heat dissipation to the housing and ambient air
Implementation Method 2
heat can convect into the current transducer from heat-generating components
Data Source
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AI summary
An electrical assembly includes a heat conducting housing (24). A conductor (24) is supported by the housing and conducts electrical current. An electrical insulator (28) member surrounds the conductor. A core (39) surrounds the insulator member and the conductor so that current flowing through the conductor induces a magnetic field in the core. A transducer (38) is coupled to the core for generating a signal representing current in the conductor. A thermal interface member (40) engages the core and engages the housing. The interface member conducts or can conduct heat to the housing.