Current Sensor Packaging Layout for IC Heat Isolation
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Solution Overview
Problem
Existing current sensors face defects due to high voltage and heat generation, particularly when measuring large currents over extended periods, leading to potential failures in the magnetoelectric conversion elements and signal processing ICs.
Innovation Solution
A current sensor design that encapsulates the primary conductor, magnetoelectric conversion element, and signal processing IC in a resin, with a configuration that minimizes heat transfer to the IC by spacing the IC supporting portion and conductor, using separate lead terminals and suspending pins for heat dissipation, and ensuring adequate creepage distance to prevent electrical defects.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the primary conductor and signal processing IC are placed close together for compact packaging, then the device size is reduced, but heat from the conductor transfers to the IC causing defects
Solution Approach 1:
The patent introduces an insulating member as an intermediary substance between the primary conductor and the signal processing IC. This insulating member acts as a thermal barrier that prevents heat transfer from the conductor to the IC, while still allowing the components to be packaged in a compact arrangement. The insulating member specifically fills the space between these components to block the harmful thermal pathway.
2Power
If high voltage is applied to the primary conductor for measuring large currents, then the measurement capability is improved, but defects occur in the magnetoelectric conversion element
Solution Approach 1:
The patent applies beforehand cushioning by providing adequate creepage distance (insulation distance) between the high-voltage primary conductor and the magnetoelectric conversion element before defects can occur. This spatial insulation is designed in advance to prevent electrical breakdown or defects in the magnetoelectric conversion element when high voltage is applied for measuring large currents.
Solution Approach 2:
The insulating member serves as an intermediary that provides electrical insulation between the high-voltage primary conductor and the magnetoelectric conversion element. This intermediary structure allows the system to handle high voltages for large current measurements while protecting the sensitive magnetoelectric conversion element from voltage-induced defects.
3Duration of action of moving object
If the measurement current flows through the primary conductor for extended periods, then the measurement duration is improved, but heat generation causes defects in the IC
Solution Approach 1:
The insulating member acts as a thermal intermediary that blocks heat transfer from the primary conductor to the signal processing IC during extended measurement periods. This allows the measurement current to flow through the conductor for long durations without the generated heat reaching and damaging the IC.
Solution Approach 2:
The patent extracts the harmful heat transfer pathway by introducing the insulating member that specifically removes the thermal coupling between the primary conductor and the signal processing IC. This extraction of the harmful thermal pathway enables extended measurement operation without heat-induced defects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the likelihood of defects by minimizing heat impact on the signal processing IC, maintaining insulation, and ensuring stable operation even with large measurement currents over extended periods.
Implementation Method 1
a magnetoelectric conversion element that detects a magnetic field generated by the measurement current
Data Source
AI summary
A current sensor is configured such that at least one magnetoelectric conversion element, a conductor, a signal processing IC, an IC supporting portion, and an element supporting portion are encapsulated with an encapsulating portion. The current sensor is comprised of a pair of first lead terminals that is partially exposed outside the encapsulating portion, is electrically connected to the conductor, inputs a measurement current to the conductor, and outputs the measurement current from the conductor; and a metal member that is partially exposed outside the encapsulating portion and is spaced apart from the conductor. The element supporting portion further supports the metal member on a surface on the same side as a first surface on which the IC supporting portion supports the signal processing IC.