Current Sensor Chip Packaging With Integrated Isolation Structure

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Solution Overview

Problem

Existing current sensors face issues of poor processing performance, low reliability, and reduced performance due to the introduction of external insulating materials for insulation, which are necessary in wire bonding and flip chip bonding processes.

Innovation Solution

A packaged chip design that includes a substrate with a protective layer made of the same material as the substrate, where the active region is bonded to the protective layer, and an isolation structure is formed between the protective layer and the substrate, eliminating the need for additional insulating materials, and optionally incorporating a top heat dissipation component with an insulating film layer and metal heat dissipation layer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If external insulating materials are introduced for wire bonding or flip chip bonding, then insulation performance is improved, but processing performance deteriorates and reliability decreases

Engineering Contradiction:

Improvedevice reliabilityVSAvoidprocessing performance

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The patent extracts and eliminates the need for external insulating materials by integrating the insulation function directly into the substrate structure through the isolation structure formed between the protective layer and substrate, thereby improving processing performance while maintaining insulation performance

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent merges the insulation function with the substrate structure by forming an isolation structure that integrates electrical isolation with the substrate and protective layer, eliminating the need for separate external insulating materials and improving both processing performance and reliability

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If external insulating materials are introduced, then insulation performance is improved, but heat dissipation performance deteriorates

Engineering Contradiction:

Improveinsulation performanceVSAvoidheat dissipation performance

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent removes external insulating materials that would impede heat dissipation, instead achieving insulation through the isolation structure formed by the protective layer and substrate interface, which allows for better thermal management

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The protective layer is made of the same material as the substrate, creating a homogeneous structure that maintains good thermal contact and heat dissipation performance while providing the necessary electrical insulation through the isolation structure

Inventive Principle:

Principle #33Homogeneity

3Reliability

If dissimilar materials are used for substrate and protective layer, then insulation performance is improved, but device reliability deteriorates due to delamination

Engineering Contradiction:

Improveinsulation performanceVSAvoiddelamination resistance

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent uses the same material for both the substrate and protective layer, creating a homogeneous structure with matched thermal and mechanical properties that prevents delamination while achieving insulation through the isolation structure formed between these layers

Inventive Principle:

Principle #33Homogeneity

Solution Approach 2:

The patent creates a composite structure where the substrate and protective layer of the same material are bonded together with an isolation structure between them, achieving both mechanical stability and electrical insulation without using dissimilar materials

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Improves insulation performance and reliability by reducing the use of dissimilar materials, enhancing heat dissipation, and preventing delamination, while maintaining efficient connection to other components without the need for external insulating materials.

Implementation Method 1

One side of the active region facing away from the substrate is bonded to the protective layer

Methodology Applied

Scientific EffectBonding: Welding

Implementation Method 2

a metal heat dissipation layer on one side facing away from the substrate

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS20260023102A1Packaged chip and current sensor

Publication Date: 2026.01.22 NINGBO CRRC TIMES TRANSDUCER TECH CO LTD

AI summary

A packaged chip and a current sensor, which are applied to the field of chip packaging. The packaged chip comprises: a substrate, a protective layer made of the same material as the substrate, and an active region prepared on one side surface of the substrate, wherein the side of the active region facing away from the substrate is bonded to the protective layer; and an isolation structure is formed between the protective layer and the substrate and on a side face of the active region. By means of the present application, the side, facing away from a substrate, of an active region prepared on the substrate is connected to a protective layer, and an isolation structure is formed between the protective layer and the substrate and on a side face of the active region, such that insulated isolation for the active region is formed.