Integrated Current Sensor Layout for Low-Noise Signal Detection
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Solution Overview
Problem
Existing current sensors face challenges in maintaining high sensitivity and responsiveness while minimizing noise interference and heat generation, particularly in applications like electric vehicles, due to long connecting wires and separate primary conductors, which can lead to deformation and increased electrical resistance.
Innovation Solution
A current sensor design that integrates a magnetoelectric conversion element and signal processing IC within a semiconductor package, using a lead frame to surround the conversion elements and minimize wire length, with a mold resin sealing to reduce noise and heat, and incorporating an IC support portion for precise alignment and reduced deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If long connecting wires are used to connect the magnetoelectric conversion element and signal processing IC separately, then ease of assembly is improved, but noise interference and heat generation increase
Solution Approach 1:
The patent combines the magnetoelectric conversion element and signal processing IC into a single integrated semiconductor package, eliminating the need for long connecting wires. This integration reduces the loop area for signal connections, thereby minimizing noise interference while maintaining ease of assembly through standardized packaging.
Solution Approach 2:
The magnetoelectric conversion element is embedded within the semiconductor package that contains the signal processing IC. This nested structure allows both components to be closely coupled with minimal wire length, reducing electromagnetic interference and heat generation while preserving manufacturing simplicity.
2Ease of manufacture
If separate primary conductors are used, then ease of manufacture is improved, but deformation and electrical resistance increase
Solution Approach 1:
The primary conductor is integrated as an internal structure within the semiconductor package rather than being a separate component. This integration eliminates deformation issues associated with separate conductors and reduces electrical resistance through optimized current paths, while the package structure itself facilitates manufacturing.
3Measurement precision
If the magnetoelectric conversion element is surrounded by the primary conductor, then sensitivity is improved, but device complexity increases
Solution Approach 1:
The primary conductor is formed as a U-shaped structure that surrounds the magnetoelectric conversion element within the semiconductor package. This nested arrangement maximizes the magnetic field coupling for high sensitivity while the integrated package structure keeps the overall device complexity manageable through standardized manufacturing processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design enhances sensitivity and responsiveness by minimizing noise interference and heat generation, while maintaining precise alignment and reducing manufacturing costs through optimized wire connections and efficient material use.
Implementation Method 1
a magnetoelectric conversion element which detects a magnetic field generated due to the measurement current
Implementation Method 2
a signal processing IC which amplifies a signal of the magnetoelectric conversion element
Data Source
AI summary
A current sensor may include a first support portion and a first lead frame which is made of a material different from that of the first support portion. The current sensor may include: a signal processing IC which has a first surface supported by a first surface of the first support portion and is electrically connected to the first lead frame; at least one magnetoelectric conversion element which is configured separately from the signal processing IC, is mounted on a second surface on a side opposite to the first surface of the signal processing IC, and outputs, to the signal processing IC, a signal processed by the signal processing IC; and a second lead frame which has a second terminal portion, at least a part of which is arranged to face the second surface of the signal processing IC, and through which a measurement current flows.