Current Sensor Packages with Through-Holes for Galvanic Isolation
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Solution Overview
Problem
Compact current sensors for high voltage semiconductor devices and circuits face challenges in miniaturization, power loss minimization, and accurate measurement while maintaining galvanic isolation, especially in size and space-constrained environments.
Innovation Solution
The development of compact current sensor packages that integrate Hall effect and Rogowski current sensors on semiconductor substrates, utilizing pass-through holes and insulation to sense current flow with galvanic isolation, allowing for accurate measurement of both DC and AC currents in high voltage systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If semiconductor device packages are miniaturized to reduce size and space, then space efficiency improves, but measurement accuracy and power loss performance deteriorate
Solution Approach 1:
The current sensor is integrated within the semiconductor device package itself, with the sensor element positioned in a recess or cavity formed in the package substrate. This nested configuration allows the sensor to be housed within the existing package footprint without increasing overall device size, while maintaining adequate spacing for accurate measurement of current flows through the semiconductor devices.
Solution Approach 2:
The package substrate incorporates three-dimensional routing layers and vertical positioning of sensor elements relative to the semiconductor devices. By utilizing vertical spacing and multi-layer construction rather than only planar expansion, the design achieves accurate current measurement without increasing the horizontal package area.
2Weight of stationary object
If semiconductor device packages are miniaturized to reduce weight, then weight efficiency improves, but power loss performance deteriorates
Solution Approach 1:
The current sensor package is merged with the semiconductor device package, sharing common structural elements such as the package substrate, sealing encapsulant, and mounting hardware. This consolidation eliminates redundant components and materials, reducing overall weight while maintaining the electrical isolation and measurement capabilities needed to minimize power losses.
Solution Approach 2:
The sensor element and its signal processing circuitry are nested within the existing package structure, utilizing available void space and routing layers. This efficient use of volume reduces the amount of material required while maintaining adequate electrical isolation and signal integrity to minimize power consumption and losses.
3Volume of stationary object
If current sensors are integrated in compact packages, then device compactness improves, but galvanic isolation performance deteriorates
Solution Approach 1:
The package substrate serves as an intermediary barrier between the high-voltage semiconductor devices and the low-voltage sensor circuitry. The substrate incorporates through-substrate vias with insulation coatings and dedicated isolation layers that provide galvanic separation, allowing compact integration while maintaining reliable electrical isolation between different potential domains.
Solution Approach 2:
Thin film insulation layers and encapsulant materials are applied between high-voltage and low-voltage regions to provide galvanic isolation. These thin but effective dielectric barriers enable compact packaging while maintaining the necessary electrical separation for safe operation in high-voltage environments.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
These sensor packages effectively minimize power losses and enhance measurement accuracy while ensuring galvanic isolation, enabling reliable current monitoring in compact, high voltage semiconductor devices and circuits.
Implementation Method 1
A current sensor is disposed in the sensor package and configured to sense current flow in the conductor
Implementation Method 2
A current sensor is disposed in the sensor package and configured to sense current flow in the conductor
Data Source
AI summary
A sensor package includes a semiconductor die including at least one current sensor. The semiconductor die includes a first pass through hole extending from one side of the semiconductor die to an opposite side of the semiconductor die. The semiconductor package further includes a second pass through hole extending from one side of the sensor package to an opposite side of the sensor package. The second pass through hole is aligned with the first pass through hole and is configured to receive a current-carrying conductor. The at least one current sensor senses current flow in the current-carrying conductor received in the second pass through hole. An end of the current-carrying conductor is coupled to a terminal on a circuit board in the sensor package.