Current Sensor Temperature Estimation for PCB Overheating
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Solution Overview
Problem
Existing current sensors face challenges in efficiently managing temperature abnormalities on circuit boards without additional sensors, which can lead to overheating and potential defects due to limited space and increased costs.
Innovation Solution
A current sensor system that estimates circuit board temperature using magnetoelectric conversion elements and a signal processing IC, estimating temperature based on heat transfer characteristics and resistance values without additional temperature sensors, and triggers alerts or power adjustments to prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If additional temperature sensors are added to monitor circuit board temperature, then temperature monitoring accuracy is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The magnetoelectric conversion element and signal processing IC perform dual functions: current measurement and temperature sensing. The temperature sensing function is derived from the same components already present in the system, eliminating the need for separate temperature sensors and reducing overall device complexity.
Solution Approach 2:
The patent makes the magnetoelectric conversion element and signal processing IC serve multiple purposes: they function as both current measurement devices and temperature sensors. By extracting temperature information from existing components through their electrical characteristics, the system achieves multi-functionality without adding dedicated temperature sensing hardware.
2Measurement precision
If additional temperature sensors are added to monitor circuit board temperature, then temperature monitoring accuracy is improved, but manufacturing cost increases
Solution Approach 1:
The existing magnetoelectric conversion element and signal processing IC provide temperature sensing capabilities through their inherent electrical characteristics, eliminating the need to purchase and install separate temperature sensors, thereby reducing manufacturing costs.
Solution Approach 2:
The patent enables existing components to serve dual purposes as both current measurement and temperature sensing elements. This multi-functionality reduces the total component count and associated manufacturing costs while maintaining adequate temperature monitoring capability.
3Device complexity
If temperature monitoring is implemented without additional sensors, then device complexity is reduced, but temperature measurement precision deteriorates
Solution Approach 1:
The patent replaces physical temperature sensors with an electrical measurement approach. By monitoring changes in the electrical characteristics (current-voltage relationships) of existing magnetoelectric conversion elements and ICs, the system infers temperature without mechanical or dedicated thermal sensing components.
Solution Approach 2:
The patent uses the electrical characteristics of existing components as intermediaries to indirectly measure temperature. Instead of directly sensing temperature, the system measures electrical parameters that correlate with temperature changes, using these electrical signatures as mediators to derive temperature information.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents circuit board overheating by accurately estimating and managing temperature, reducing the risk of defects and maintaining system reliability while avoiding the need for additional components.
Implementation Method 1
at least one magnetoelectric conversion element in a current sensor
Implementation Method 2
a predetermined coefficient which is based on at least one of a heat transfer characteristic between the at least one magnetoelectric conversion element and the land portion or a heat transfer characteristic between the signal processing IC and the land portion
Data Source
AI summary
An estimation apparatus includes: an estimation unit which estimates a temperature of a circuit board which includes a current sensor and a land portion in contact with a primary terminal of the current sensor and on which the current sensor is mounted, based on a predetermined coefficient which is based on at least one of a heat transfer characteristic between at least one magnetoelectric conversion element in the current sensor and the land portion or a heat transfer characteristic between a signal processing IC and the land portion in the circuit board, and at least one of: at least one of a current value or a voltage value of the at least one magnetoelectric conversion element; or at least one of a current value or a voltage value of the signal processing IC.