Current Sensor Substrate With U-Shaped Conductor and Height Offset

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Solution Overview

Problem

Conventional current sensors with U-shaped current paths require complex manufacturing processes and increased costs due to separate conductive clips and lead terminals, which complicates the manufacturing process and increases costs.

Innovation Solution

A current sensor substrate with a U-shaped primary conductor, a support portion for a magneto-electric conversion element, and integrated lead terminals, where the current path is not overlapped with the support portion in plan view but has a different height in side view, allowing for simplified configuration and reduced component count, thereby lowering manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a separate conductive clip is provided and coupled to lead terminals, then the current sensor can be assembled, but manufacturing cost increases and manufacturing process becomes complex

Engineering Contradiction:
Improvemanufacturing process simplicityVSAvoidnumber of components
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The patent integrates the conductive clip function directly into the lead terminal structure. The lead terminal is formed with a bent portion that serves as the clipping mechanism, eliminating the need for a separate conductive clip component. This merging of functions reduces component count and simplifies the manufacturing process while maintaining the electrical connection and mechanical clamping functions.

Inventive Principle:
Principle #5Merging (Combining)

2Reliability

If the current path is positioned at the same height as the support portion, then manufacturing is simpler, but insulation and voltage resistance properties deteriorate

Engineering Contradiction:
Improveinsulation and voltage resistanceVSAvoidstructural complexity
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent positions the current path at a different height (vertical dimension) relative to the support portion rather than only in the planar dimension. This vertical separation creates electrical insulation and prevents voltage breakdown while maintaining a compact overall structure. The height difference introduces a third dimension to the layout, solving the insulation problem without significantly increasing planar complexity.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design simplifies the manufacturing process, reduces the number of components, and enhances insulation and voltage resistance properties between the primary conductor and IC chip, resulting in cost-effective and reliable current sensors with improved sensitivity.

Implementation Method 1

a magneto-electric conversion element for detecting magnetic flux to be generated by electric current flowing through the current path

Methodology Applied
Scientific EffectMagnetic flux detection: Electromagnetic Induction

Data Source

PatentUS9448256B2Current sensor substrate and current sensor
Publication Date: 2016.09.20 ASAHI KASEI MICRODEVICES CORP
  • US9448256B2 patent drawing
  • US9448256B2 patent drawing
  • US9448256B2 patent drawing

AI summary

It is intended to reduce manufacturing cost in a current sensor including a primary conductor having a U-shaped current path. A current sensor includes a primary conductor having a U-shaped current path, a support portion for supporting a magneto-electric conversion element, and a lead terminal connected to the support portion, and wherein the current path is not overlapped with the support portion in a plan view, while being formed so as to have a height different from that of the support portion in a side view.