Current Sensor Semiconductor Substrate Stiffness
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Solution Overview
Problem
Current sensors with magnetoelectric conversion elements face issues due to low stiffness insulating members deforming during resin encapsulation, leading to variations in measurement sensitivity and increased manufacturing costs due to the need for dedicated apparatuses.
Innovation Solution
A current sensor design featuring a semiconductor package with a magnetoelectric conversion element, signal processing IC, and conductor encapsulated by mold resin, where the insulating member is replaced by a semiconductor substrate with sufficient stiffness to prevent deformation, and the manufacturing process uses standard back-end process equipment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If an insulating member with low stiffness is used to support the magnetoelectric conversion element, then the structure is simple and easy to manufacture, but the insulating member deforms during resin encapsulation causing variation in measurement sensitivity
Solution Approach 1:
The patent changes the stiffness parameter of the insulating member by selecting a material with appropriate elastic modulus (1-100 GPa) and controlling thickness (1-50 μm) to achieve both dimensional stability during encapsulation and ease of manufacture. This parameter optimization resolves the contradiction between manufacturing simplicity and measurement precision.
2Manufacturing precision
If a dedicated apparatus is used to cut and attach the insulating member, then the manufacturing precision is improved, but the device complexity and manufacturing cost increase
Solution Approach 1:
The patent makes the insulating member suitable for processing with standard back-end equipment by optimizing its material properties and dimensions, allowing one apparatus to perform multiple functions (cutting, attaching, and supporting) without requiring dedicated specialized equipment. This reduces device complexity while maintaining manufacturing precision.
3Volume of moving object
If the insulating member is made thinner to reduce size, then the sensor size is reduced, but the stiffness decreases causing deformation during encapsulation
Solution Approach 1:
The patent uses composite material structures for the insulating member, combining materials with different mechanical properties to achieve both thinness (for compact sensor size) and sufficient stiffness (to prevent deformation during encapsulation). This composite approach resolves the contradiction between miniaturization and structural strength.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces variations in measurement sensitivity, improves sensor quality, and lowers production costs by eliminating the need for dedicated equipment, achieving a small, highly sensitive, and cost-effective current sensor.
Implementation Method 1
a magnetoelectric conversion element that detects a magnetic field generated by the measurement current
Data Source
AI summary
A current sensor includes at least one magnetoelectric conversion element, a conductor that at least partially surrounds the at least one magnetoelectric conversion element in a plan view and through which a measurement current to be measured with the at least one magnetoelectric conversion element flows, an element supporting portion comprised of a semiconductor substrate, and supports the at least one magnetoelectric conversion element and the conductor on a first surface, a signal processing IC that processes a signal that is output from the at least one magnetoelectric conversion element, an encapsulating portion that encapsulates the at least one magnetoelectric conversion element, the conductor, and the signal processing IC, and a pair of first lead terminals that is partially exposed on a side surface of the encapsulating portion and is electrically connected to the conductor, inputs the measurement current to the conductor and outputs the measurement current from the conductor.