Curved 2D Array Transducer with Segmented ASIC
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Solution Overview
Problem
The production of curved two-dimensional array transducers is complicated by the difficulty in connecting interior elements due to their curved backside and the large number of signal and control conductors, which is exacerbated by the presence of a rigid ASIC in the transducer array stack.
Innovation Solution
A method where a flat array transducer with an ASIC or integrated circuitry is bonded between the piezoelectric material and a flexible substrate, allowing the array stack to be diced with cuts that penetrate the ASIC along the azimuthal axis, enabling the array to be curved while maintaining functional ASIC segments, and individual segments are wired together to restore control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a rigid ASIC is bonded directly into the transducer array stack for a flat array, then the interconnection of array elements to the ASIC is simplified, but the array cannot be curved
Solution Approach 1:
The ASIC is diced into multiple segments along the azimuthal axis, creating separate ASIC segments that can be distributed across the curved array. Each segment remains electrically functional and can be independently positioned, allowing the rigid ASIC structure to be adapted to the curved geometry while maintaining simplified interconnections within each segment's local region.
Solution Approach 2:
The solution transitions from a two-dimensional flat array configuration to a three-dimensional curved configuration by bending the array along the azimuthal axis. This dimensional change allows the array to achieve the desired curvature while the ASIC segments are distributed across this new spatial arrangement, maintaining functional connectivity.
2Adaptability or versatility
If the array is curved to achieve the desired shape, then adaptability is improved, but the ASIC circuitry is damaged by the curvature process
Solution Approach 1:
By dividing the ASIC into segments before curving, each segment becomes a smaller, more manageable unit that can withstand the curvature process. The segmentation reduces the mechanical stress on any single ASIC structure during bending, preventing circuitry damage while still achieving the overall curved configuration.
Solution Approach 2:
The ASIC is diced into segments before the curving process begins. This preliminary action prepares the ASIC structure to accommodate curvature by creating discrete segments that can be positioned and connected along the curved path, preventing damage that would occur if the intact ASIC were subjected to bending forces.
3Adaptability or versatility
If dicing cuts penetrate the ASIC to divide it into segments, then the array can be curved, but the ASIC circuitry may be damaged
Solution Approach 1:
The dicing process applies different cutting depths to different regions of the ASIC. Cuts are made only through specific portions of the ASIC where segmentation is required, while leaving other regions intact to maintain circuitry functionality. This selective dicing approach enables curvature capability while preserving essential circuit connections.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the interconnection of array elements to the ASIC, allowing for the successful curvature of two-dimensional array transducers without damaging the ASIC circuitry, facilitating the production of curved 2D array transducers for medical diagnostic ultrasound systems.
Implementation Method 1
a piezoelectric material layer 20
Data Source
Figure 1
Figure 2
Figure 2A
AI summary
A curved two-dimensional array transducer includes a layer of piezoelectric material (20) overlayi ng a layer of ASICs (26) which is attached to a backing wing (16). The piezoelectric material (20) is diced in orthogonal azimuth and elevation directions to form a two -dimensional array of transducer elements, with the dicing cuts in the elevation direction extending through the ASIC layer (26) so that the piezoelectric layer (20) and the ASIC layer (26) can be bent in the azimuth direction. The backing wing (16) provides a flexible substrate which can be bent while supporting the ASIC layer (26) and piezoelectric elements (20). In a second example the piezoelectric layer (20) and ASIC layer (26) are attached to opposite sides of flex circuit which provides the flexible substrate after the piezoelectric layer (20) and ASIC layer (26) are diced.