Curved Array Substrate Via Hole Stress Management
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Solution Overview
Problem
The stress on the film layer increases when a curved display screen is bent, leading to potential breakage and affecting the display effect.
Innovation Solution
A curved array substrate design featuring a substrate with a first metal layer, an insulating layer of silicon nitride or silicon oxide, a semiconductor layer, and a second metal layer connected through a via hole near the bending center, with channels penetrating through the second metal layer to reduce stress and enhance connection strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the display screen is bent to create a curved display, then the viewing angle is widened and product differentiation is achieved, but the stress on the film layer increases causing breakage
Solution Approach 1:
The patent applies local quality by creating a via hole specifically at the bending center location rather than uniformly across the entire structure. This localized modification allows the second metal layer to connect to the first metal layer at the critical stress point, providing reinforcement where it is most needed while maintaining the overall curved display structure and its viewing angle benefits.
2Reliability
If a via hole is defined in the insulating layer near the bending center, then the connection strength is enhanced and breakage is prevented, but the manufacturing process becomes more complex
Solution Approach 1:
The patent applies segmentation by dividing the manufacturing process into distinct sequential steps: forming the first metal layer, depositing the insulating layer, creating the via hole through etching, and forming the second metal layer. This segmented approach to manufacturing, while adding process steps, allows each step to be optimized independently and ensures precise control over the via hole formation and metal layer connections, ultimately enhancing reliability through systematic process control.
Data Source
AI summary
A curved array substrate includes a substrate, a first metal layer disposed on the substrate, an insulating layer disposed on the substrate and covering the first metal layer, a semiconductor layer disposed on the insulating layer and a second metal layer disposed on the insulating layer and connected to the semiconductor layer, and a via hole is defined in the insulating layer near a bending center thereof, and the second metal layer is connected to the first metal layer through the via hole.