Curved Back Plate Preload for Heat Sink Mounting
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Solution Overview
Problem
Conventional heat sink designs for electronic systems face reduced thermal performance due to screws with springs that cut into the surface, reducing space for fins and causing degradation in heat dissipation.
Innovation Solution
A back plate with an initial curvature is used to apply a preload on a circuit board, allowing screws to penetrate partially through the heat sink without cutting its surface, eliminating the need for springs and enhancing heat transfer by minimizing gaps between components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If screws with springs are used to mount the heat sink, then the heat sink is firmly affixed to the PCB, but the screws cut into the heat sink surface reducing fin space and heat dissipation efficiency
Solution Approach 1:
A back plate is introduced as an intermediary component between the screws and the heat sink. The back plate receives the clamping force from the screws and distributes it uniformly across the heat sink base through its curved elastic deformation, eliminating the need for screws to directly contact and cut into the heat sink surface while maintaining firm mounting.
Solution Approach 2:
The back plate utilizes elastic deformation (change in shape parameter) under screw clamping force to achieve uniform pressure distribution. The curved geometry of the back plate allows it to deform elastically, transforming the concentrated point loads from screws into a distributed pressure field across the heat sink base.
2Reliability
If screws penetrate through the heat sink surface, then secure mounting is achieved, but the surface area for fins is reduced and heat flow resistance increases
Solution Approach 1:
The mounting function is segmented into two separate components: the back plate that contacts the heat sink surface and the screws that provide clamping force. This segmentation allows the screws to remain outside the heat sink surface area while the back plate distributes the clamping force, preserving the full surface area for fins.
Solution Approach 2:
The back plate serves as a mediator that transfers the mounting force from the screws to the heat sink without requiring screw penetration into the heat sink body, thereby preserving the heat sink surface area.
3Stability of the object's composition
If screws with springs are used, then adequate preload is applied to minimize gaps, but additional components and complexity are introduced
Solution Approach 1:
The spring component is extracted (removed) from the mounting structure. The back plate's elastic deformation inherently provides the necessary preload and gap minimization without requiring separate spring elements, thus reducing component count and structural complexity.
Solution Approach 2:
The back plate's elastic properties are utilized to provide automatic preload adjustment. As the back plate deforms under screw clamping, it naturally applies and maintains the necessary preload force to minimize gaps between components, replacing the need for mechanical springs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach improves heat dissipation efficiency by maintaining the integrity of the heat sink's surface area, reducing costs, and simplifying the mounting process while ensuring secure electrical connections.
Implementation Method 1
a back plate having an initial curvature and positioned at a second side of the circuit component opposite to the heat sink
Implementation Method 2
a heat sink is a passive heat exchange component that cools down a device by dissipating heat into the surrounding medium, such as air
Implementation Method 3
Screws with springs are inserted through the heat sink, thermal interface material, and PCB to hold and firmly affix the different components to each other, which ensures efficient heat transfer from the PCB to the heat sink
Data Source
AI summary
Apparatus and method embodiments are provided for a heat sink mounted on a printed circuit board using a back plate with preload. An apparatus comprises a circuit component, a heat sink on a first side of the circuit component a, a back plate having an initial curvature and positioned at a second side of the circuit component opposite to the heat sink, and one or more screws through the back plate and the circuit component and partially through the heat sink. A method further includes placing and flattening a curved back plate on a second side of a circuit board opposite to the first side, and fastening the back plate, the circuit board, and the heat sink together by inserting a plurality of screws through the back plate, the circuit board, and a partial depth on a single side of the heat sink.