Curved Bonding Head for Void-Free 3D Package Assembly
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Solution Overview
Problem
Existing 3D IC bonding technologies face challenges in achieving high-quality and reliable package structures due to voids and gaps between bonded components, which affect the integrity and performance of integrated circuits.
Innovation Solution
A processing apparatus with a non-planar bonding head, featuring a curved bottom surface, deforms the package components to minimize gaps by contacting them from the center to the edges, using vacuum holes for secure holding and a resilient material to ensure deformation without damage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional planar bonding methods are used, then the bonding process is simple, but voids and gaps form between bonded components reducing quality and reliability
Solution Approach 1:
The bonding head employs a non-planar curved bottom surface instead of a flat surface. This curvature allows the bonding head to conform to the package component shape, ensuring continuous contact from center to edges during the bonding process, thereby eliminating voids and gaps while maintaining process simplicity
Solution Approach 2:
The bonding head is designed with resilient material that allows it to deform dynamically during bonding. The head can flex to match the package component contour, ensuring consistent contact pressure across the bonding interface, which prevents void formation without requiring complex rigid positioning mechanisms
2Manufacturing precision
If a non-planar bonding head is used to minimize gaps, then bonding quality improves, but the apparatus complexity increases
Solution Approach 1:
The bonding head utilizes resilient material properties that allow it to change its physical state between deformed and non-deformed configurations. By controlling the deformation parameter through vacuum pressure application, the system achieves precise contact uniformity without requiring mechanically complex adjustable mechanisms
Solution Approach 2:
The resilient bonding head automatically conforms to the package component shape through its own elastic properties. The vacuum holes and resilient material work together to self-adjust the bonding head deformation, eliminating the need for external complex positioning or control systems
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the quality and reliability of package structures by minimizing voids and gaps, improving the bonding process and ensuring consistent contact between components.
Implementation Method 1
holding the upper package component with a plurality of vacuum holes
Implementation Method 2
A processing apparatus with a non-planar bonding head, featuring a curved bottom surface, deforms the package components to minimize gaps
Data Source
AI summary
A method for forming a package structure is provided. The method includes deforming an upper package component on a surface of a bonding head by holding the upper package component with a plurality of vacuum holes along opposite edges of the bonding head, and a peak of the surface is located between the opposite edges of the bonding head. The method includes aligning the upper package component with a lower package component. The method includes pressing the upper package component onto the lower package component until an edge of the upper package component contacts an edge of the lower package component. The method includes releasing the upper package component from the bonding head.