Curved Cavity Chip Substrate for Central Illuminance
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Solution Overview
Problem
Existing chip substrates face challenges in enhancing illuminance in the central portion, particularly when using a hemispherical lens, which is difficult to process and results in increased device thickness.
Innovation Solution
A chip substrate with a cavity defined by a plurality of curved surfaces, including a planar surface, is designed to increase illuminance, featuring conductive portions laminated in one direction with insulation between them, and a cavity formed on the upper surface with curved surfaces of predetermined radii of curvature, allowing for easy processing and reduced thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a hemispherical lens is used to increase illuminance in the central portion, then the light reflection performance is enhanced, but the processing difficulty increases and the device thickness increases
Solution Approach 1:
The patent applies spherical curvature to the cavity surface to enhance light reflection and increase illuminance in the central portion. The curved surface of the cavity acts as a reflective element that directs light toward the central area, achieving improved illumination without requiring a hemispherical lens.
2Illumination intensity
If a hemispherical lens is used to increase illuminance in the central portion, then the light reflection performance is enhanced, but the device thickness increases
Solution Approach 1:
The patent uses a curved cavity surface instead of a hemispherical lens to achieve light concentration. This approach maintains the illuminance enhancement benefit while avoiding the additional thickness that would be required for a separate hemispherical lens component.
3Ease of operation
If mechanical processing or chemical etching is used to form mounting spaces, then the chip mounting capability is achieved, but the manufacturing complexity increases
Solution Approach 1:
The patent combines the mounting space formation and the cavity formation into a single integrated structure. The cavity serves both as the mounting space for the chip and as the light-reflecting element, eliminating the need for separate processing steps and reducing manufacturing complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves high illuminance in the central portion with an easy-to-process planar lens, reducing the thickness of the chip package and the overall device compared to using a hemispherical lens.
Implementation Method 1
the cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature
Implementation Method 2
increasing the illuminance in a central portion by forming a cavity defined by a plurality of curved surfaces
Data Source
AI summary
A chip substrate includes conductive portions, an insulation portion and a cavity. The conductive portions are laminated in one direction to constitute the chip substrate. The insulation portion is interposed between the conductive portions to electrically isolate the conductive portions. The cavity is formed on an upper surface of the chip substrate at a predetermined depth in a region including the insulation portion. The cavity is defined by a plurality of continuously-extending curved surfaces having predetermined radii of curvature.