Curved Circuit Layer Thickening for Current Density Management
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Solution Overview
Problem
In power modules, current concentration at curve points on circuit layers leads to high joule heat and thermal deformation, causing ceramic materials to peel off and resulting in uneven current density and temperature distribution among wires and chip groups.
Innovation Solution
The electronic device package structure incorporates thickening layers at curve portions of circuit layers, which gradually increase in width away from conductive portions to shunt current and reduce current density, thereby dispersing heat and preventing thermal deformation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If a line on the circuit layer reaches a curve point, then the current flows through the curve point, but local current concentration occurs causing sudden sharp rise of current density
Solution Approach 1:
The patent applies local quality by making the curve portion thickness different from the conductive portion thickness. Specifically, the curve portion has a greater thickness (at least partial thickness of the first curve portion is greater than the thickness of the first conductive portion) to locally alter current distribution and prevent concentration at the curve point.
Solution Approach 2:
The patent changes the physical parameter of thickness at the curve portion. By increasing the thickness of the curve portion compared to the conductive portion, the patent modifies the electrical and thermal parameters to reduce current density concentration and improve heat dissipation at the curve point.
2Power
If current density rises sharply at curve point, then current flows through the line, but high joule heat is generated causing temperature rise
Solution Approach 1:
The patent applies local quality by creating a curve portion with different thickness properties than the conductive portion. This local structural modification provides enhanced heat dissipation capability at the curve point where high temperature occurs, while maintaining normal current conduction in the conductive portions.
Solution Approach 2:
The curve portion acts as an intermediary structure between the conductive portions. It serves as a thermal management interface that dissipates heat generated by current flow, preventing excessive temperature rise at the curve point while maintaining electrical connectivity.
3Power
If local high temperature occurs due to joule heat, then current flows through the line, but thermal deformation occurs
Solution Approach 1:
The patent applies local quality by making the curve portion have greater thickness than the conductive portion. This local structural enhancement provides improved thermal stability and mechanical strength at the curve point, preventing thermal deformation while maintaining current conduction capability.
4Ease of operation
If wires have non-uniform current density, then wires connect the circuit layer with input/output terminal, but high temperature occurs in partial wires
Solution Approach 1:
The patent changes the thickness parameter of the circuit layer at the curve portion to improve current distribution in connected wires. By increasing the curve portion thickness, the patent creates a more favorable electrical potential distribution that promotes uniform current density in the wires, reducing localized overheating.
5Reliability
If ceramic is peeled from the circuit layer line, then insulation and heat dissipation structure is maintained, but bonding integrity is compromised
Solution Approach 1:
The patent applies local quality by enhancing the thickness of the curve portion where ceramic peeling is most likely to occur. This local structural reinforcement improves the bonding interface strength and thermal management at the curve point, preventing ceramic peeling while maintaining the insulation and heat dissipation functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively reduces current density and junction temperature of electronic devices, enhancing heat dissipation efficiency and preventing ceramic peeling, while maintaining a symmetric and efficient current flow.
Implementation Method 1
local current concentration is liable to occur, which causes a sudden sharp rise of a current density, thereby generating relatively high joule heat
Implementation Method 2
generating a high temperature in partial wires... generating a thermal deformation phenomenon caused by the local high temperature
Data Source
AI summary
An electronic device package structure including a substrate, a first circuit layer, a second circuit layer, an electronic device and an input/output device is provided. The first circuit layer includes a first conductive portion, a second conductive portion and a first curve portion located between the first conductive portion and the second conductive portion. At least a partial thickness of the first curve portion is greater than a thickness of the first conductive portion. The electronic device disposed on the second circuit layer is electrically connected to the second conductive portion of the first circuit layer. The input/output device disposed corresponding to the first conductive portion is electrically connected to the first conductive portion of the first circuit layer.