Curved Composite Mount Surface for Underfill Void Reduction
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Solution Overview
Problem
Composite components mounted on circuit boards experience reduced electric connectivity due to voids formed in the underfill layer, which affects the reliability of electronic devices.
Innovation Solution
The composite component design includes a mount surface with curved surfaces that correspond to the shape of electronic components, allowing voids in the uncured underfill layer to move out, and an adhesive layer with varying thickness to facilitate void movement, thereby reducing voids in the underfill layer and maintaining electric connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a flat mount surface is used, then the manufacturing process is simple, but voids are formed in the underfill layer reducing electric connectivity
Solution Approach 1:
The mount surface is designed with curved surfaces instead of a flat surface. The curved mount surface allows voids in the underfill layer to move toward the edges and be expelled during the underfill process, preventing void formation that would reduce electric connectivity. This curvature principle directly resolves the contradiction by sacrificing some manufacturing simplicity to achieve reliable electric connectivity.
2Reliability
If the underfill layer is applied quickly, then productivity is improved, but voids are trapped reducing reliability
Solution Approach 1:
The curved mount surface design enables voids to naturally move toward the edges during underfill application, allowing for effective void reduction even with faster application speeds. The curvature creates a flow path for voids to escape, reducing the need for extremely slow application processes.
3Reliability
If a curved mount surface is used, then voids are expelled improving electric connectivity, but manufacturing complexity increases
Solution Approach 1:
The curved mount surface is formed by shaping the composite component itself rather than requiring separate complex fabrication processes. The curvature is integrated into the component structure, allowing standard manufacturing techniques to create the desired shape without excessive complexity.
Data Source
AI summary
A composite component includes an Si base layer that has first and second main surfaces that are opposite to each other, a rerouting layer on the first main surface, a through-silicon via that is electrically connected to the rerouting layer, and that extends through the Si base layer, and an electronic component layer on the second main surface of the Si base layer, and that includes electronic components each including an electronic component body and a component electrode on the electronic component body. The component electrode is connected to the through-silicon via. One or more of the electronic components have a curved shape that is curved to protrude in a mount direction in a cross-sectional view. A mount surface of the composite component corresponds to the curved shape in a cross-sectional view, and includes one or more first curved surfaces that are curved to protrude in the mount direction.