Conductive Laminate Curved Surface Deformation Resistance

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Solution Overview

Problem

Conductive laminates with three-dimensional shapes, particularly those with curved surfaces, tend to deform under external forces, compromising their stability and functionality in applications like touch sensors.

Innovation Solution

A method for manufacturing conductive laminates involving the formation of a to-be-plated layer precursor on a flexible substrate, bonding it to a support, applying energy to create a patterned layer, deforming it into a three-dimensional shape, and performing plating to form a metal layer, with the inclusion of functional groups and polymerizable groups to enhance stability and adhesion of the plating catalyst.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If a conductive laminate with a three-dimensional curved surface is manufactured, then the laminate can be used in touch sensors with curved surfaces, but the laminate deforms under external forces

Engineering Contradiction:
Improvecurved surface capabilityVSAvoiddeformation resistance
Core Design Contradiction:
Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The support is deformed into a three-dimensional shape with a curved surface before the plating treatment is applied. This preliminary deformation ensures that the conductive laminate maintains its curved shape and resists deformation under external forces during subsequent use in touch sensors

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The conductive laminate is formed as a composite structure consisting of a support (such as a flexible substrate) and a metal layer deposited on it. This composite structure combines the mechanical stability of the support with the conductivity of the metal layer, enabling the laminate to maintain its curved three-dimensional shape while resisting deformation

Inventive Principle:
Principle #40Composite materials

2Shape

If a to-be-plated layer precursor is formed on a flexible substrate and then deformed, then a three-dimensional curved shape is achieved, but the plating catalyst application becomes more complex

Engineering Contradiction:
Improvethree-dimensional curved shapeVSAvoidplating catalyst application process
Core Design Contradiction:
ShapeVSDevice complexity

Solution Approach 1:

The to-be-plated layer precursor is formed on the flexible substrate before the substrate is deformed into the final three-dimensional shape. This preliminary formation allows the plating catalyst to be applied more easily on a flat surface, simplifying the overall process while still achieving the desired curved shape

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The flexibility of the substrate allows it to be deformed into various three-dimensional shapes without compromising the integrity of the to-be-plated layer precursor. This parameter change (from flat to curved) is achieved while maintaining the functional properties needed for subsequent plating

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method results in a conductive laminate with a three-dimensional curved surface that is resistant to deformation by external forces, ensuring reliable performance in touch sensors and other applications.

Implementation Method 1

the to-be-plated layer precursor layer contains a functional group interacting with a plating catalyst or a precursor thereof

Methodology Applied
Scientific EffectAdsorption: Adsorption

Implementation Method 2

a step C of applying energy to the to-be-plated layer precursor layer so as to form a patterned layer to be plated

Methodology Applied
Scientific EffectPhotopolymerisation: Photopolymerisation

Data Source

PatentUS11003297B2Method of manufacturing conductive laminate, conductive laminate, and touch sensor
Publication Date: 2021.05.11 FUJIFILM CORP
  • US11003297B2 patent drawing
  • US11003297B2 patent drawing
  • US11003297B2 patent drawing

AI summary

A method of manufacturing a conductive laminate includes extracting a long flexible substrate from a roll on which the flexible substrate is wound, forming a to-be-plated layer precursor layer on at least one main surface of the flexible substrate while the extracted flexible substrate is transported in the longitudinal direction, preparing a support, bonding the flexible substrate with a to-be-plated layer precursor layer to at least one main surface of the support, applying energy to the support with a to-be-plated layer precursor layer to obtain a support with a patterned layer to be plated, forming the support into a three-dimensional shape including a curved surface, and performing a plating treatment on the patterned layer to be plated to obtain the conductive laminate having a three-dimensional shape.