Curved Contact Projections for Semiconductor Testing
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Solution Overview
Problem
Conventional semiconductor element testing devices face challenges in achieving accurate electrical contact due to the limitations of projection geometry and insulation film penetration, leading to suboptimal test current application and increased contact resistance.
Innovation Solution
A current application device with a contact section featuring curved projections that deform to a planar shape upon pressing, allowing inclined projections to scrape off the insulation film and increase the exposed surface area of the semiconductor electrode, thereby improving electrical contact and reducing contact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If projections are pressed against the semiconductor element to apply test current, then electrical contact is established, but contact resistance increases due to insufficient film penetration and limited exposed electrode area
Solution Approach 1:
The contact section is designed with a curved surface instead of a planar surface. This curvature allows the projections to approach the semiconductor element surface at inclined angles, enabling them to scrape off the electrical insulation film more effectively and expose larger areas of the surface electrode, thereby reducing contact resistance and improving electrical contact quality
Solution Approach 2:
The projections are designed to be movable rather than fixed in orientation. When the curved contact section is pressed against the semiconductor element, the projections dynamically adjust their orientation from inclined positions to align with the pressing direction. This dynamic behavior enables the distal ends of the projections to effectively scrape off the insulation film and establish reliable electrical contact
2Ease of manufacture
If projections are oriented perpendicular to the surface for direct contact, then application is simple, but the insulation film cannot be effectively scraped off to expose sufficient electrode area
Solution Approach 1:
The curved surface of the contact section naturally orients projections at inclined angles relative to the semiconductor element surface. This geometric configuration enables the projections to effectively scrape off the electrical insulation film during pressing, exposing larger areas of the surface electrode while maintaining manufacturing simplicity
Solution Approach 2:
The projections are pre-oriented at inclined angles on the curved contact section before pressing begins. This preliminary angular orientation is designed to facilitate effective film scraping action when the contact section is pressed against the semiconductor element, ensuring sufficient electrode exposure is achieved during the testing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device enhances electrical contact accuracy and reduces contact resistance by exposing a larger surface area of the semiconductor electrode, allowing for more precise testing of electrical characteristics.
Implementation Method 1
the plane of the curved shape is deformed into a planar shape when pressed by the pressing section
Implementation Method 2
the distal ends of the projections scrape off the film of the area with which the distal ends of the projections come in contact
Data Source
AI summary
Provided are a current application device capable of improving the electrical contact between projections of a contact section and a surface electrode when applying a test current to a semiconductor element, and a method of manufacturing a semiconductor element properly tested by using the current application device. The current application device includes a contact section that has a plurality of projections, which are brought into contact with a surface electrode of a semiconductor element to apply a test current, and a pressing section that presses the contact section against the semiconductor element such that the projections penetrate a film to come in contact with the surface electrode. The contact section has a plurality of the projections on a plane that has been formed in a curved shape, and the curved-shaped plane is deformed into a planar shape by being pressed by the pressing section.