Curved Corner Electronic Substrate Stress Dispersion
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Solution Overview
Problem
Semiconductor devices with pointed corner portions are prone to cracking when external forces are applied, leading to a deterioration in quality due to the concentration of stress at these points.
Innovation Solution
The electronic component features a substrate with curved corner portions that connect its side surfaces, dispersing external forces along the curved surface to prevent cracking, and a manufacturing method that cuts wafers to create these curved corners in electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the corner portion is formed with a pointed shape, then the manufacturing process is simplified, but the stress concentration occurs leading to cracking and quality deterioration
Solution Approach 1:
The corner portion is designed with a curved surface instead of a pointed shape, replacing the sharp angle with a smooth arc that has a radius of curvature between 0.1mm and 1.0mm. This curvature eliminates stress concentration points while maintaining manufacturing feasibility through standard cutting processes.
2Force
If external force is applied to the electronic component, then the component performs its function, but the pointed corner portion concentrates stress leading to cracking
Solution Approach 1:
The curved surface at the corner portion distributes applied external forces across a broader area, preventing stress concentration. The radius of curvature (0.1mm to 1.0mm) is specifically designed to effectively disperse forces while maintaining the component's overall size constraints.
3Reliability
If the corner portion has a curved surface, then stress is dispersed and crack resistance is improved, but the manufacturing complexity increases
Solution Approach 1:
The curvature radius is controlled within a specific range (0.1mm to 1.0mm) to balance stress dispersion effectiveness with manufacturing ease. This parameter optimization ensures that standard cutting tools and processes can achieve the curved shape without requiring complex specialized equipment or multi-step procedures.
Data Source
AI summary
An electronic component includes a substrate including a first principal surface, a second principal surface positioned on a side opposite to the first principal surface, a first side surface that connects the first principal surface and the second principal surface and that extends along a first direction, a second side surface that connects the first principal surface and the second principal surface and that extends along a second direction intersecting the first direction, and a corner portion that connects the first side surface and the second side surface and that has a curved surface curved outwardly, and a chip arranged at the first principal surface of the substrate.