Curved Semiconductor Die Support Structure for Substrate Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing semiconductor packages struggle to effectively protect semiconductor dies from environmental contaminants and facilitate attachment to curved surfaces, limiting the field of view and data collection capabilities.
Innovation Solution
A method involving a die curvature support structure made of organic material is used to induce warpage greater than 200 microns in semiconductor dies, allowing them to be curved and bonded to a correspondingly curved substrate, using vacuum force, rotation, or pressing to achieve the desired shape.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If semiconductor die are kept flat for traditional packaging, then manufacturing and assembly are simplified, but attachment to curved surfaces is impossible and field of view is limited
Solution Approach 1:
The patent applies preliminary action by pre-curving the semiconductor die before bonding to the curved substrate. The die is shaped to match the target curved surface in advance, allowing direct attachment without complex real-time adjustment mechanisms. This pre-shaping enables the die to conform to the curved geometry while maintaining manufacturing feasibility through controlled bending processes.
Solution Approach 2:
The patent directly applies curvature by bending the semiconductor die into an arc shape that matches the curved substrate. This transforms the traditional flat die geometry into a curved configuration, enabling attachment to curved surfaces and expanding the field of view for sensors while maintaining electrical functionality.
2Adaptability or versatility
If semiconductor die are curved to match substrate geometry, then attachment to curved surfaces is enabled, but manufacturing precision and die flatness are compromised
Solution Approach 1:
The patent applies parameter changes by controlling the curvature radius and bend angle of the semiconductor die to match specific substrate geometries. By adjusting these geometric parameters, the die can be precisely shaped to conform to different curved surfaces while maintaining manufacturing precision through controlled deformation processes that prevent excessive stress or damage.
3Adaptability or versatility
If larger warpage is induced in semiconductor die, then attachment to curved surfaces with larger radii is achieved, but die stress and potential cracking increase
Solution Approach 1:
The patent applies local quality by concentrating the curvature transformation at specific regions of the die rather than uniformly bending the entire structure. This localized bending approach reduces stress distribution across the die, preventing cracking while achieving the necessary warpage for attachment to curved surfaces with larger radii.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables seamless attachment of semiconductor dies to curved surfaces, enhancing data collection capabilities and field of view, while providing protection against environmental factors.
Implementation Method 1
The die curvature support structure may induce warpage greater than 200 microns in the surface of the semiconductor die
Implementation Method 2
Warping the semiconductor die against the surface further may include using vacuum force
Data Source
AI summary
Implementations of a curved die system may include a semiconductor die; and a die curvature support structure including an organic material coupled to a surface of the semiconductor die. The die curvature support structure may induce warpage greater than 200 microns in the surface of the semiconductor die. The die curvature support structure may be configured to induce warpage prior to coupling the semiconductor die to a correspondingly curved substrate.