Curved Display Module Driving Chip Tilting to Resolve Stress Mismatch

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Solution Overview

Problem

The tilting phenomenon of driving chips on flexible circuit films in curved display modules due to stress differences between the display panel and printed circuit board leads to assembly defects and increased manufacturing costs.

Innovation Solution

The curved display module design includes flexible circuit films connected to the display panel with driving chips tilted in anticipation of stress, ensuring alignment along the circumferential direction of the panel, reducing stress on the chips and enhancing contact force, thereby minimizing defects and manufacturing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If the printed circuit board is disposed on a rear surface of a receiving member that accommodates the display panel, then the curved display module structure is simplified, but stresses applied to both ends of the flexible circuit film become different due to curvature difference, causing the driving chip to tilt

Engineering Contradiction:
Improvemodule structureVSAvoiddriving chip alignment
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The driving chip is tilted in advance by a predetermined angle during mounting on the flexible circuit film, so that when stress is applied after assembly, the chip automatically aligns parallel to the curved display panel. This preliminary tilting action prevents the chip from becoming misaligned due to curvature-induced stress differences between the display panel and printed circuit board.

Inventive Principle:
Principle #10Preliminary action

2Ease of manufacture

If the driving chip is mounted perpendicular to the flexible circuit film, then the mounting process is simplified, but the chip tilts due to stress differences caused by curvature mismatch between the display panel and printed circuit board

Engineering Contradiction:
Improvechip mountingVSAvoidchip alignment stability
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The driving chip is tilted in advance by a predetermined angle during mounting on the flexible circuit film, so that when stress is applied after assembly, the chip automatically aligns parallel to the curved display panel. This preliminary tilting action prevents the chip from becoming misaligned due to curvature-induced stress differences between the display panel and printed circuit board.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS11353731B2Curved display module and display apparatus having the same
Publication Date: 2022.06.07 SAMSUNG DISPLAY CO LTD
  • US11353731B2 patent drawing
  • US11353731B2 patent drawing
  • US11353731B2 patent drawing

AI summary

A curved display module includes a curved display panel curved with a first curvature in a first direction. A plurality of flexible circuit films are connected to a side portion of the curved display panel. A plurality of driving chips are each mounted on the flexible circuit films. A printed circuit board is connected to the flexible circuit films and is curved with a second curvature in the first direction. Two sides parallel to each other of each of the flexible circuit films are in direct contact with the curved display panel at first and second contact points, respectively, and are in direct contact with the printed circuit board at third and fourth contact points, respectively. A distance between the first and third contact points is different from a distance between the second and fourth contact points.