Curved Display Flex Wiring Layout to Reduce Twisting Stress

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Solution Overview

Problem

In electronic devices with curved display surfaces, flexible wiring boards face stress due to being connected to both curved display panels and plate-like circuit boards, leading to reliability issues such as twisting and breakage.

Innovation Solution

The configuration of flexible wiring boards is optimized by mounting them closer to the center of the curved mounting portion, reducing stress and twisting by aligning their centers with the display panel's center, and using a curved mounting portion that matches the display surface shape, with pads and IC chips positioned to minimize stress on the wiring.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If flexible wiring boards are connected to both curved display panels and plate-like circuit boards, then connectivity is achieved, but stress is applied to the flexible wiring board causing twisting and breakage

Engineering Contradiction:
ImprovereliabilityVSAvoidstress resistance
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The flexible wiring board is divided into multiple sections with different curvature radii. The first section has a larger curvature radius for connection to the circuit board, while the second section has a smaller curvature radius for connection to the display panel. This segmentation allows each section to be optimized for its specific connection requirements, reducing overall stress and preventing twisting.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different portions of the flexible wiring board are given different properties through varying curvature radii. The first section (connected to circuit board) has larger curvature radius for easier bending, while the second section (connected to display panel) has smaller curvature radius for better conformability. This local differentiation optimizes stress distribution throughout the wiring board.

Inventive Principle:
Principle #3Local quality

2Ease of manufacture

If flexible wiring boards are mounted away from the center of the curved mounting portion, then installation is easier, but stress and twisting increase leading to breakage

Engineering Contradiction:
Improveinstallation easeVSAvoidstress resistance
Core Design Contradiction:
Ease of manufactureVSReliability

Solution Approach 1:

The flexible wiring board is segmented into multiple sections with different curvature radii, allowing the board to be mounted at optimized positions while maintaining stress resistance. The segmentation enables the board to adapt to curved surfaces without excessive stress, resolving the conflict between installation ease and reliability.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The curvature radius parameter is varied along the length of the flexible wiring board. By changing this geometric parameter from one section to another, the wiring board can be mounted at different positions on curved surfaces while maintaining appropriate stress levels, thus achieving both ease of installation and reliability.

Inventive Principle:
Principle #35Parameter changes

Data Source

PatentUS11910528B2Electronic device
Publication Date: 2024.02.20 JAPAN DISPLAY INC
  • US11910528B2 patent drawing
  • US11910528B2 patent drawing
  • US11910528B2 patent drawing

AI summary

According to one embodiment, an electronic device includes a panel, a circuit board, a first flexible wiring board, and a first IC chip. The panel includes a curved display surface, a mounting portion curved, and a plurality of first pads disposed at intervals on the mounting portion. The circuit board is a plate-like. The first flexible wiring board has a first end portion mounted on the plurality of first pads and a second end portion connected to the circuit board. The first IC chip is mounted on the mounting portion and electrically connected to the first flexible wiring board. A first center of the first flexible wiring board is closer to a third center of the panel than a second center of the first IC chip in plan view.