Curved Display Interconnect Substrate Flexibility
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Solution Overview
Problem
Forming displays for electronic devices with curved surfaces is challenging, as it can lead to adverse effects on display performance and result in unsightly, overly large inactive border areas if not handled properly.
Innovation Solution
A flexible interconnect substrate with compound curvature is used, featuring signal routing lines that are integrated into the substrate, allowing the display panel to be mounted without forming an undesirably large inactive border, and incorporating flexibility enhancement openings or materials like silicone to prevent wrinkling and buckling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a display is formed with surface curvature, then the display can conform to curved surfaces, but the inactive border areas become overly large and unsightly
Solution Approach 1:
The patent moves signal routing from the two-dimensional display surface plane into the third dimension by routing signals through the thickness of the substrate and using interconnect substrates positioned at different layers. This allows signals to be routed beneath the active display area rather than around it, eliminating the need for large inactive borders.
Solution Approach 2:
The patent implements a multi-layer nested structure where the display panel is mounted on an interconnect substrate, which itself is mounted on a support structure. The interconnect substrate contains embedded conductors that are nested within the substrate layers, allowing signal routing to occur within the nested layers rather than occupying surface area.
2Adaptability or versatility
If a display is formed with surface curvature, then the display can conform to curved surfaces, but display performance is adversely affected
Solution Approach 1:
The patent employs flexible interconnect substrates and thin-film conductors that can bend and conform to curved surfaces without cracking or degrading. The interconnect substrate is designed with sufficient flexibility to match the curvature of the display while maintaining electrical connectivity and structural integrity.
Solution Approach 2:
The patent uses composite structures combining the display panel, interconnect substrate, and support structure, where each layer is designed with specific mechanical and electrical properties. The composite structure as a whole provides both the required flexibility for curvature and the structural stability needed for reliable display performance.
3Adaptability or versatility
If the interconnect substrate is made flexible to allow compound curvature, then the display can conform to curved surfaces, but the substrate may wrinkle and buckle
Solution Approach 1:
The patent applies different structural characteristics to different regions of the interconnect substrate. The substrate is designed with local reinforcement in areas prone to wrinkling and buckling, while maintaining flexibility in areas that need to conform to curvature. This localized differentiation of structural properties allows the substrate to achieve compound curvature without compromising overall structural integrity.
4Ease of manufacture
If signal routing lines are placed on the display surface, then signals can be routed to the display panel, but the inactive border areas become overly large
Solution Approach 1:
The patent extracts the signal routing function from the display surface plane and relocates it to the interconnect substrate layers beneath the active display area. The conductors are taken out from the visible surface and embedded within the substrate structure, eliminating the need for large inactive borders to accommodate signal routing lines.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the creation of displays with curved surfaces while minimizing the inactive border and maintaining display performance, allowing for seamless integration with curved surfaces without compromising pixel density or visibility.
Implementation Method 1
the interconnect substrate may be formed from a material with a low elastic modulus such as silicone or other elastomeric material
Data Source
AI summary
An electronic device display may have pixels formed from crystalline semiconductor light-emitting diode dies, organic light-emitting diodes, or other pixel structures. The pixels may be formed in a display panel having a single substrate or an array of display panel tiles. The display panel has inwardly facing display panel contacts that mate with corresponding outwardly facing interconnect substrate contacts on an interconnect substrate. The interconnect substrate may have areas with compound curvature that are overlapped by the display panel. To enhance flexibility of the interconnect substrate, the interconnect substrate may have flexibility enhancement openings and/or may be formed from a material with a low elastic modulus such as silicone or other elastomeric material.