Curved Display Panel Substrate Cutting and Grinding Method
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Solution Overview
Problem
Existing methods for producing liquid crystal panels with non-rectangular outlines, such as curved shapes, face challenges in precision due to overlapping cut lines and uneven stress, leading to burrs or chips at intersection points, making it difficult to achieve high-precision production.
Innovation Solution
A method involving bonding substrates with thin film patterns, forming cut lines between mounting and other areas, cutting into pieces, grinding the substrates along the outline to form edge surfaces, and removing parts along cut lines, which reduces stress and burr formation by avoiding intersection points and using a layering process with curing resin to streamline the production process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the bonded substrate is cleaved with scribing along a slanted cutting line that forms the outline of the liquid crystal panel, then the non-rectangular outline shape is achieved, but the cut lines overlap at intersection points causing uneven stress and burrs or chips
Solution Approach 1:
The patent divides the outline formation process into two separate operations: (1) cleaving the bonded substrate along cutting lines to separate panel areas, and (2) forming the final outline shape by removing substrate portions after cutting. This segmentation prevents overlapping cut lines by performing outline formation after the cutting step, thereby eliminating burrs and chips at intersection points while maintaining manufacturing precision.
2Ease of manufacture
If the cutting line for terminal intersects with the slanted cutting line at the edge surface, then the mounting area is formed, but uneven stress acts on intersection points making it difficult to produce panels with high precision
Solution Approach 1:
The patent performs the cutting operation to form the mounting area before performing the outline formation operation. By preliminarily establishing the mounting area through cutting, the subsequent outline formation can be performed without intersecting cut lines, thereby avoiding stress concentration at intersection points while maintaining ease of manufacture.
3Manufacturing precision
If multiple cut lines are used to form both the outline and mounting area, then the panel structure is defined, but burrs or chips are likely to be produced at intersection points
Solution Approach 1:
The patent segments the structure formation into distinct phases: first cutting the bonded substrate to define panel areas and mounting regions, then separately removing substrate portions to form the final outline. This temporal and operational segmentation ensures that no cut lines intersect during the outline formation phase, eliminating the generation of burrs and chips while maintaining precise structural definition.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of liquid crystal panels with curved outlines and mounting areas with high precision, minimizing the occurrence of burrs or chips and unintentional cracks, thereby improving the accuracy and efficiency of the manufacturing process.
Implementation Method 1
bonding substrates in a pair one of which has thin film patterns and forming a bonded substrate
Implementation Method 2
grinding the substrates in a pair that are outside the thin film pattern in each of the separated bonded substrate pieces along the outline and forming edge surfaces of the display panels each having the curved outline
Data Source
AI summary
A producing method includes a bonding process of bonding substrates in a pair one of which has thin film patterns and forming a bonded substrate, a cut forming process of forming a cut line CL1 on a border portion between the mounting area within the panel surface area and other area on the one substrate of the bonded substrate, a cutting process of cutting the bonded substrate into separated bonded substrate pieces, a grinding process of grinding the substrates in a pair that are outside the thin film pattern in each of the separated bonded substrates 50A along the outline and forming edge surfaces of the display panels each having the curved outline, and a removing process of cutting a part of the one substrate along the cut line and removing the part.