Curved Display Panel Edge Grinding Method
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing methods for producing display panels with curved outlines face challenges in achieving high precision and reducing the frame width due to stress-induced cracking and inaccurate cutting along curved lines, which can deform the panel and increase the frame width.
Innovation Solution
A method involving a sealing agent disposing process, bonding, cutting outside the sealing agent portions, and a grinding process to align and reduce the sealing agent width, ensuring precise cutting and grinding to form curved edges without unintended cracks, thereby maintaining bonding strength and reducing the frame width.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If substrates are cut along a curved cutting line with a dicing method or scribing method, then the display panel can have a curved outline, but cracks may be unintentionally generated at different portions from the cutting line due to stress of the sealing agent, causing deformation and lowering accuracy
Solution Approach 1:
The cutting process is divided into two distinct stages: first, cutting the substrates outside the sealing agent portions along substantially straight lines; second, grinding the sealing agent portions and substrate edges collectively along curved lines. This segmentation allows each process to operate under optimal conditions, avoiding stress-induced cracking while achieving the desired curved outline with high precision.
Solution Approach 2:
The substrates are cut outside the sealing agent portions before the sealing agent is ground. This preliminary cutting action removes the bulk material along straight lines where cracking is less likely, preparing the workpiece for the subsequent precise curved grinding of the sealing agent portions without the risk of stress-induced cracks during the more critical curved cutting phase.
2Reliability
If cutting is performed away from the sealing agent to avoid stress influence, then cracks are reduced, but the width of the frame portion is increased and reduction in frame width is not achieved
Solution Approach 1:
The frame width reduction is achieved by segmenting the sealing agent portion into two functional zones: the inner region that bonds substrates (maintaining reliability) and the outer edge region that is ground away collectively with the substrate to reduce frame width. This allows the sealing agent to serve dual purposes while achieving both crack prevention and frame width reduction.
Solution Approach 2:
The grinding process merges the processing of the sealing agent portion and substrate edges into a single collective operation. By grinding both together along the curved outline, the frame width is reduced while maintaining the bonding integrity of the sealing agent's inner region, thus achieving both reliability and compact dimensions.
3Manufacturing precision
If substrates and sealing agent are collectively ground, then the ground surfaces are aligned and frame width is reduced, but the process complexity increases
Solution Approach 1:
The grinding process combines the processing of multiple components (substrates and sealing agent portions) into a single collective operation. This merging approach achieves precise surface alignment and frame width reduction in one step, which actually simplifies the overall process compared to separate processing steps that would require additional alignment operations.
Solution Approach 2:
The grinding process serves multiple functions simultaneously: it shapes the curved outline, aligns the ground surfaces of substrates and sealing agent, and reduces the frame width. This multi-functionality in a single process step improves manufacturing precision without proportionally increasing process complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of display panels with curved outlines of high precision and reduced frame width, minimizing cracks and maintaining effective bonding strength, thus enhancing the accuracy and yield of the production process.
Implementation Method 1
a grinding process of grinding collectively the substrates in a pair and one of the sealing agent portions that are overlapped with each other a plan view after the cutting process
Data Source
AI summary
A producing method includes a sealing agent disposing process of preparing substrates one of which has thin film patterns thereon and disposing sealing agent portions on the one substrate to surround the thin film patterns, respectively, a bonding process of bonding the substrates via the sealing agent portions and forming a bonded substrate after the sealing agent disposing process, a cutting process of cutting the substrates being included in the bonded substrate and outside the sealing agent portions after the bonding process, and a grinding process of grinding collectively the substrates and the sealing agent portions of the bonded substrate along the outline after the cutting process such that overlapped portions of the substrates and the sealing agent portion are partially ground collectively and ground surfaces of the substrates and the sealing agent portion are aligned with each other.