Curved Electrode Connections in Multilayer Ceramic Capacitors
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Solution Overview
Problem
Multilayer ceramic capacitors face challenges in preventing delamination and breakdown voltage reduction while maintaining low equivalent series inductance, primarily due to the design of the connection portions between internal and external electrodes, which can lead to electric field concentration and reliability issues.
Innovation Solution
The design incorporates internal electrodes with curved connection portions and corner portions, having a curvature radius of 30 to 100 μm, and a distance of at least 200 μm between lead parts, along with external electrodes positioned to reduce stress and prevent plating liquid penetration, enhancing the structural integrity and electrical performance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If the connection portion is positioned closer to the edge of the dielectric layer to reduce equivalent series inductance, then low ESL is achieved, but delamination occurs due to stress concentration at the step portion
Solution Approach 1:
The connection portion is designed with a curved surface instead of a sharp step, having a curvature radius of 10-50 μm. This curved transition eliminates the abrupt step portion that causes stress concentration, thereby preventing delamination while maintaining the low ESL benefit of the close positioning
2Quantity of substance
If the margin part size is reduced to increase capacitance, then ultra-high capacity is achieved, but breakdown voltage decreases due to reduced insulation margin
Solution Approach 1:
The dielectric layer is designed with non-uniform thickness: a thinner margin part (first thickness) in the insulation region and a thicker connection part (second thickness greater than first thickness) at the electrode connection region. This local variation optimizes both capacitance and breakdown voltage by providing sufficient insulation margin where needed while enabling closer electrode positioning for higher capacitance
3Volume of moving object
If dielectric layers and internal electrodes are thinned for ultra-miniaturization, then small size is achieved, but manufacturing precision becomes more difficult to maintain
Solution Approach 1:
The patent specifies precise parameter ranges: curvature radius of 10-50 μm for the connection portion and controlled thickness variations between margin part and connection part. These defined parameters provide clear manufacturing targets that enable consistent production of ultra-thin structures with high precision
Data Source
AI summary
There is provided a multilayer ceramic electronic part, including: a ceramic element having a plurality of dielectric layers laminated therein; and a plurality of first and second internal electrodes each including a body part formed on at least one surface of each of the plurality of dielectric layers within the ceramic element, the first and second internal electrodes including first and second lead parts extended from one surfaces of the body parts to be exposed through one surface of the ceramic element, respectively, wherein inside connection portions between the body parts and the first and second lead parts are curvedly formed, and have a curvature radius of 30 to 100 μm.