Curved External Electrodes for Laminated Electronic Components
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Solution Overview
Problem
Conventional laminated coil components often experience poor connections between external electrodes and circuit board lands due to trapped air, which can lead to inefficient soldering and unstable mounting.
Innovation Solution
The electronic component features a laminate with rectangular insulator layers and curved external electrodes, allowing for better solder flow and preventing air entrapment by design, with thicker lead-out and dummy conductors that create a bulging formation area to enhance solder attachment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If external electrodes are provided as flat plates on the mounting surface, then the structure is simple and manufacturing is easy, but air becomes trapped in the solder causing poor connections
Solution Approach 1:
The external electrode is designed with a curved surface that protrudes from the mounting surface, forming a convex shape. This curvature allows air to escape during soldering by creating a pathway for air bubbles to rise and exit the solder joint, preventing air entrapment and ensuring reliable electrical connections between the electrode and the circuit board land.
2Reliability
If the formation area is made larger to improve solder attachment, then soldering reliability improves, but air entrapment increases
Solution Approach 1:
The curved, protruding shape of the external electrode creates a gradient in the formation area where the contact surface with the land varies in height. This geometric design allows the solder to flow around and under the electrode while air bubbles can escape through the curved surfaces, simultaneously achieving good solder attachment and preventing air entrapment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures stable attachment of external electrodes to the circuit board, preventing tilting and ensuring reliable connections by allowing air to escape from the solder, thus improving the mounting process and reducing the risk of poor connections.
Implementation Method 1
obtaining the laminate in an unsintered state, the laminate being provided with the first lead-out conductors and the conductive members; and firing the laminate
Data Source
AI summary
An electronic component comprises: a laminate having a plurality of rectangular insulator layers and a mounting surface formed by a series of sides of the insulator layers. A plurality of first lead-out conductors are exposed between the insulator layers at the mounting surface. A first external electrode covers the first lead-out conductors at the mounting surface. The first external electrode is located at a first formation area at the mounting surface. The first formation area, when viewed in a plan view in an extending direction in which the sides of the insulator layers that constitute the mounting surface extend, is curved so as to bulge at a center of the formation area relative to opposite ends thereof.