Curved Electronic Device Modulation Layer Heat Absorption
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Solution Overview
Problem
In the manufacturing of curved electronic devices, thermoplastic substrates undergo significant bending deformation, leading to damage of electronic components and breakage of connecting wiring, especially in areas with greater curvature, due to the limitations of existing molding technologies.
Innovation Solution
A curved electronic device design featuring a substrate with a modulation layer having pattern and blank areas, where the substrate's heat absorption rates differ, allowing for adjustable stretching and preventing damage to electronic components and wiring during the thermoforming process by varying the softening degrees across the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Shape
If the thermoplastic substrate is heated and shaped using conventional molding technology, then the desired curved shape is achieved, but the electronic components and connecting wiring are damaged or broken due to excessive bending deformation
Solution Approach 1:
The substrate is divided into multiple regions with different heat absorption rates (first region with higher heat absorption rate, second region with lower heat absorption rate), allowing different parts to soften at different rates and control the deformation distribution, thereby protecting electronic components in high-deformation areas
Solution Approach 2:
Different regions of the substrate are assigned different heat absorption characteristics - the first region (without electronic components) has higher heat absorption rate for greater softening and deformation, while the second region (with electronic components) has lower heat absorption rate to maintain structural integrity and protect components during shaping
2Ease of manufacture
If the substrate is made with uniform heat absorption rate, then the manufacturing process is simple, but the electronic components and wiring cannot be protected from damage in high deformation areas
Solution Approach 1:
The substrate incorporates regions with different heat absorption rates - the first region has higher heat absorption rate while the second region has lower heat absorption rate, enabling localized control of softening and deformation to protect electronic components without significantly complicating the manufacturing process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces the risk of damage to electronic components and connecting wiring by allowing controlled deformation, ensuring the integrity of the components during the shaping process while maintaining the desired curved form.
Implementation Method 1
The modulation layer and the substrate have different heat absorption rates, so that the substrate corresponding to the blank area and the pattern area has different degrees of softening
Implementation Method 2
the thermoplastic substrate 1 is heated to an appropriate softening temperature. Then, a pressurized gas is poured into the mold 2 to shape the thermoplastic substrate 1 in the mold 2
Data Source
AI summary
A curved electronic device and a method for manufacturing the same are disclosed. The curved electronic device includes a substrate, a component layer, and a modulation layer. The component layer is disposed on the substrate. The component layer is composed of a plurality of electronic components and their connecting wiring arranged on the substrate. The modulation layer is disposed on the component layer, and includes at least one pattern area and at least one blank area that are formed on the component layer. The blank area allows one part of the electronic components to be exposed out of the modulation layer. The modulation layer and the substrate have different heat absorption rates, so that the positions of the substrate corresponding to the blank area and the pattern area have different degrees of softening, so as to prevent the component layer from being damaged in the process of stretching the substrate.