Curved Electronic Structure With Variable Pitch and Under-Support Circuitry
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Traditional electromagnetic wave emitting structures limit the functionality and quality of operation areas on the lateral and back surfaces of electronic devices due to their design constraints.
Innovation Solution
An electronic structure with a substrate having a flat and curved part, where electronic units are disposed with different pitches on each surface, and a circuit structure is electrically connected to support improved functionality, allowing for enhanced operation on non-traditional surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If traditional electromagnetic wave emitting structures are used, then the structure is simple and easy to manufacture, but the functionality and quality of operation areas on lateral and back surfaces are limited
Solution Approach 1:
The substrate is divided into multiple regions including a front surface, lateral surfaces, and back surface, each with independently controllable electronic units. This segmentation allows different parts of the device to have specialized functions, enhancing overall adaptability while maintaining manageable complexity through modular design
Solution Approach 2:
The patent extends the operational area from traditional 2D front surface to 3D surfaces including lateral and back surfaces. By utilizing multiple dimensions of the substrate, the device achieves enhanced versatility without proportionally increasing structural complexity, as the additional functional areas share common support infrastructure
2Productivity
If electronic units are arranged with different pitches on flat and curved parts, then the operational performance is optimized, but the manufacturing precision requirements increase
Solution Approach 1:
Different regions of the substrate are assigned different electronic unit pitches according to their specific functional requirements. The front surface uses one pitch configuration optimized for primary operations, while lateral and back surfaces use different pitch configurations suited for their respective functions. This local optimization enhances overall productivity without requiring uniform high precision across the entire device
Solution Approach 2:
The pitch parameter of electronic units is varied across different regions of the substrate. By changing this geometric parameter locally rather than maintaining a constant value, the system optimizes operational performance for each specific area while the variations are managed through systematic design rather than ad-hoc adjustments
3Reliability
If the circuit structure overlaps the region between electronic units, then electrical connection is achieved, but the area available for electronic units is reduced
Solution Approach 1:
The circuit structure is positioned in the vertical dimension beneath the electronic units rather than occupying lateral space. This vertical stacking arrangement allows electrical connections to be established without reducing the horizontal area available for electronic unit placement, effectively resolving the space conflict through dimensional reorganization
Data Source
AI summary
An electronic structure includes a substrate, a plurality of electronic units disposed on the substrate, a circuit structure electrically connected with at least one of the plurality of electronic units, and a support element disposed under the substrate. The substrate has a first flat part and a curved part connected with the first flat part. At least two adjacent ones of the plurality of electronic units on the first flat part have a first pitch. A least another two adjacent ones of the plurality of electronic units on the curved part have a second pitch different from the first pitch. In a normal direction of the first flat part, at least a portion of the circuit structure overlaps a region between the at least two adjacent ones of the plurality of electronic units on the first flat part. The circuit structure is disposed under the support element.