Curved Electrostatic Chuck Surface for Warped Substrate Adsorption
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Solution Overview
Problem
Existing electrostatic chucks struggle to stably adsorb substrates with high insulating properties and significant warpage, such as sapphire substrates, leading to reduced contact area and inadequate adsorption force, which affects etching quality.
Innovation Solution
The electrostatic chuck features a convex or concave placement surface designed to match the warpage of the substrate, increasing contact area and adsorption force by adjusting the shape of the placement surface to the substrate's warpage, using a base body with embedded electrostatic electrodes and a base plate for stable adsorption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a flat placement surface is used in the electrostatic chuck, then the structure remains simple, but the contact area with warped substrates is reduced leading to inadequate adsorption force
Solution Approach 1:
The placement surface is designed with convex or concave curvature to match the warpage shape of substrates. This curved surface configuration increases the contact area between the electrostatic chuck and warped substrates, thereby improving adsorption force and stability without requiring complex additional components
2Reliability
If the placement surface is made convex or concave to match substrate warpage, then the contact area and adsorption force are improved, but the manufacturing complexity increases
Solution Approach 1:
The curvature radius of the placement surface is optimized to balance adsorption performance and manufacturing feasibility. By carefully selecting the curvature radius parameter, the design achieves effective matching with substrate warpage while maintaining reasonable manufacturing complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The modified placement surface enhances adsorption performance, allowing sufficient adsorption of substrates with high insulating properties even at high warpage, ensuring uniform temperature control and improved etching quality.
Implementation Method 1
an electrostatic chuck body for electrostatically adsorbing a substrate
Data Source
AI summary
An electrostatic chuck includes a base body having a placement surface on which a target object to be adsorbed is to be placed; and an electrostatic electrode embedded in the base body, wherein a surface of the base body opposite to the placement surface is a flat surface, and the placement surface is convex or concave with respect to the flat surface.