Curved Film Frame Carrier for Faster Wafer Die Transfer
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Solution Overview
Problem
Existing semiconductor die transfer apparatuses are limited by the positioning speed of linear motors, which restricts the acceleration and efficiency of die transfer due to motor topology and power dissipation constraints.
Innovation Solution
The apparatus employs a rotationally mounted curved shell on the wafer chuck, actuated by a motor for rotational movement, which allows higher force and torque per unit of power and weight, enabling increased acceleration and positioning speed, along with a releasing unit that can use light or a needle for die release, and auxiliary mechanisms like compressed air to overcome gravitational forces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If linear motors are used for wafer stage positioning, then the system structure is simple, but the acceleration and positioning speed are limited due to motor topology and power dissipation constraints
Solution Approach 1:
The patent replaces the linear motor system with a rotational motor system. The wafer chuck is rotated to position semiconductor wafers, and the release needle is moved radially to position individual dies. Rotational motors provide higher torque and power density, enabling faster acceleration and positioning speeds without the same power dissipation limitations as linear motors.
Solution Approach 2:
The patent introduces a curved shell structure that rotates to position the wafer. The curved geometry allows the wafer to be positioned at different angular locations, and the radial movement of the release needle along the curved path enables precise die placement. This curved rotational approach replaces the linear XY stage movement.
2Speed
If linear motors are used for wafer stage positioning, then the system is easy to control, but the acceleration is limited by motor topology
Solution Approach 1:
The patent substitutes the linear motor topology with rotational motors that drive the wafer chuck and release mechanism. Rotational motors inherently provide higher acceleration capabilities through torque multiplication, and the control system manages the rotational to linear motion conversion, achieving higher acceleration without the topological limitations of linear motors.
3Productivity
If direct die transfer is used, then the transfer process is simple and fast, but the positioning speed limits the number of dies transferred per unit time
Solution Approach 1:
The patent replaces the linear positioning system with rotational motors that can accelerate faster. The wafer chuck rotates to bring different die locations to the release point, and the release needle moves radially to transfer dies. This rotational mechanism achieves higher positioning speeds, increasing the throughput of dies transferred per unit time while maintaining the simplicity of direct transfer.
Data Source
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AI summary
Aspects of the present disclosure relate to an apparatus for transferring a semiconductor die from an arrangement of semiconductor dies to a target. Further aspects of the present disclosure relate to a wafer stage to be used in such apparatus, to a film frame carrier to be used with such an apparatus, and to an assembly comprising the film frame carrier and an arrangement of semiconductor dies arranged thereon. According to an aspect of the present disclosure, the wafer chuck comprises a rotationally mounted curved shell on which the arrangement of semiconductor dies can be arranged, and the wafer stage further comprises a first motor for rotating the curved shell around a rotational axis. The curved configuration allows for an improved throughput of the wafer stage. The film frame carrier to be used with this wafer stage comprises a ring-shaped body with an asymmetric bending stiffness allowing the ring-shaped body to be bent such that the mounting surface of the ring-shaped body changes from having a first shape to a second more concave shape and preventing or limiting the ring-shaped body to be bent such that the shape of the mounting surface becomes more convex than the first shape.