Curved Heat Transfer Device for Balanced Thermal Distribution
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Solution Overview
Problem
Electronic systems, such as memory sub-systems, face inefficiencies in thermal energy distribution and removal due to standardized enclosures that inhibit even heat transfer, leading to sub-optimal component layouts and unbalanced thermal loads, which can impact performance and reliability.
Innovation Solution
A bent or curved shaped heat transfer device is used to thermally couple with both the top and bottom portions of electronic system enclosures, efficiently distributing thermal energy from components on the primary and secondary sides of the circuit board, thereby reducing localized heat concentrations and improving thermal efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If standardized enclosures are used to house electronic components, then manufacturing and assembly are simplified, but thermal energy distribution becomes unbalanced and heat transfer efficiency deteriorates
Solution Approach 1:
The patent applies curvature to the heat transfer device by using a bent or curved shaped configuration instead of flat surfaces. This curved geometry enables the device to conform to the enclosure surfaces and improve thermal contact, allowing heat to be distributed more evenly across the enclosure while maintaining standardized manufacturing benefits.
Solution Approach 2:
The patent transitions from two-dimensional flat heat transfer surfaces to three-dimensional bent configurations. The heat transfer device extends in multiple dimensions with bent portions that wrap around enclosure surfaces, enabling thermal coupling across multiple sides of the enclosure simultaneously and achieving balanced heat distribution.
2Adaptability or versatility
If components are placed on both primary and secondary sides of the circuit board to optimize layout, then space utilization improves, but thermal load becomes unbalanced and localized heat concentrations increase
Solution Approach 1:
The heat transfer device is segmented into multiple portions including first, second, third, fourth, fifth, and sixth portions that can independently contact different components on various sides of the circuit board. This segmentation allows each segment to manage thermal loads from specific components or regions, distributing heat more evenly across the enclosure.
Solution Approach 2:
The heat transfer device serves multiple functions by thermally coupling to components on both primary and secondary sides of the circuit board simultaneously. The bent configuration enables the device to act as a universal thermal management solution that handles heat from various component locations and directs it to multiple enclosure surfaces.
3Ease of manufacture
If flat heat transfer devices are used, then manufacturing is simpler, but thermal coupling efficiency to multiple enclosure surfaces deteriorates
Solution Approach 1:
The patent employs curved or bent geometries in the heat transfer device to match the contours of enclosure surfaces. This curvature enables better thermal contact area and heat transfer pathways to multiple sides of the enclosure, significantly improving thermal coupling efficiency while remaining manufacturable through standard forming processes.
Solution Approach 2:
The bent heat transfer device acts as an intermediary between heat-generating components and the enclosure surfaces. Its curved configuration allows it to bridge thermal gaps and create continuous thermal pathways that flat devices cannot achieve, effectively mediating heat transfer across complex geometric interfaces.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution more evenly distributes thermal energy, enhancing the reliability, consistency, and performance of electronic components by balancing heat transfer across multiple sides of the circuit board, allowing for higher thermal loads and flexible component placement.
Implementation Method 1
the first portion of the exterior surface is configured to thermally couple to the top portion of the enclosure, wherein the second portion of the exterior surface is configured to thermally couple to the bottom portion of the enclosure
Data Source
Figure 1
Figure 2A~2B
Figure 3
AI summary
A system with a circuit with components, an enclosure with a top and a bottom, and a heat transfer device. The heat transfer device has an exterior surface with a first portion, a second portion, and a third portion, where the first portion faces opposite the second portion; and an interior surface with a fourth portion, a fifth portion, and a sixth portion, where the fourth portion faces the fifth portion. The first portion configured to thermally couple to the top of the enclosure. The second portion configured to thermally couple to the bottom of the enclosure. The fourth portion configured to couple to a component mounted on a primary side of the circuit board. The fifth portion configured to face a secondary side of the circuit board. The first heat transfer device configured to distribute thermal energy generated from a component to the top and bottom of the enclosure.