Curved Image Sensor Die with Adhesive Bonding for Alignment
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Solution Overview
Problem
High-end mobile computing devices require miniature cameras with superior performance and high image quality while minimizing space and energy consumption, posing challenges in the design and manufacturing of camera components.
Innovation Solution
An image sensor device with a substrate and a die having a curved surface, where a heat-cured or pressure-sensitive adhesive layer provides a fixed attachment between the substrate and the die, allowing for precise alignment and curvature to match the focal radius of the lens, enabling efficient energy and space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the dimensions of camera components are decreased to enable miniaturization, then space consumption is reduced, but manufacturing precision and alignment accuracy become more difficult to achieve
Solution Approach 1:
The patent applies curvature to the die surface to match the curved surface of the substrate, creating a focal radius relationship that enables precise alignment in miniature camera components. This curved surface configuration allows the image sensor to maintain accurate positioning despite reduced component dimensions.
Solution Approach 2:
The patent changes the geometric parameters of the die by introducing a curved surface with a specific focal radius that matches the substrate's curved surface. This parameter modification enables the alignment of miniature components while maintaining manufacturing feasibility and precision.
2Volume of moving object
If the dimensions of camera components are decreased, then space consumption is reduced, but image quality may deteriorate
Solution Approach 1:
The curved surface configuration with matched focal radii enables the miniature image sensor to maintain optimal light focusing properties, thereby preserving image quality despite reduced component size. The curvature geometry ensures proper optical path alignment in the miniaturized system.
3Manufacturing precision
If a curved surface configuration is used to match focal radius, then alignment precision is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the curved surface formation into the substrate manufacturing process itself, rather than requiring separate post-processing steps. This integration approach maintains alignment precision while reducing overall manufacturing complexity by consolidating operations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances image sensor performance by optimizing alignment and attachment, leading to improved image quality and reduced size and power consumption in miniature camera systems for mobile devices.
Implementation Method 1
The adhesive layer positioned between the curved surface of the substrate and the die provides a fixed attachment between the die and the substrate
Data Source
AI summary
An image sensor device includes a substrate, a die, and an adhesive layer positioned between the substrate and the die. The substrate includes a first side having a curved surface. The die includes an image sensor component attached to the curved surface of the substrate. At least a portion of the die comprising the image sensor component has a curved surface. The adhesive layer positioned between the curved surface of the substrate and the die provides a fixed attachment between the die and the substrate.