Curved Image Sensor on Flexible Substrate for Wide-Angle Imaging
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Solution Overview
Problem
Existing image sensors based on crystalline silicon substrates are difficult to curve, leading to logistical challenges and potential cracking when forming wide-angle imaging systems, as they require complex and expensive lens systems to accommodate a narrow field of view.
Innovation Solution
A method of forming a curved image sensor by creating a spiral pattern of individually addressable photo-detector pixels on a flexible substrate, which is then bent into a three-dimensional shape such as a hemisphere, allowing for a wide-angle imaging system with simpler and lighter lens systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a flat image sensor is used, then the manufacturing process is simple and reliable, but the field of view is narrow requiring complex lens systems
Solution Approach 1:
The patent applies curvature by forming the image sensor in a hemispherical shape rather than using a flat substrate. This curvature allows the sensor to directly capture light from a wide field of view without requiring complex lens systems, while still using standard semiconductor manufacturing processes on the curved surface
2Adaptability or versatility
If a curved image sensor is formed using crystalline silicon, then the sensor can achieve wide angle imaging, but sensor cracking occurs due to excessive stress
Solution Approach 1:
The patent changes the material parameter from crystalline silicon to amorphous silicon, which has different mechanical properties that allow it to withstand the stress of curvature without cracking. This material substitution enables the sensor to maintain both its curved shape for wide-angle imaging and its structural integrity for reliable operation
3Adaptability or versatility
If complex lens systems are used to widen field of view, then the field of view increases, but the system weight and cost increase significantly
Solution Approach 1:
The patent uses a hemispherical sensor shape that naturally captures light from a wide field of view without requiring additional lens elements. This eliminates the need for heavy, complex lens systems while maintaining the desired wide-angle imaging capability, thereby reducing overall system weight
4Adaptability or versatility
If complex lens systems are used to widen field of view, then the field of view increases, but the system cost increases significantly
Solution Approach 1:
The hemispherical sensor configuration provides wide-angle imaging through its geometric shape alone, eliminating the need for multiple lens elements and complex optical paths. This simplifies the overall device structure and reduces manufacturing costs while achieving the desired field of view expansion
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the creation of a curved image sensor that can handle a wider field of view with reduced weight and cost, while minimizing strain on the substrate to prevent cracking, facilitating the use of amorphous silicon or organic semiconductors for efficient light detection.
Implementation Method 1
n array of individually addressable photo-detector pixels is formed in a spiral pattern
Data Source
AI summary
A method of making a curved sensor is described. The method involves projecting portions of a curved three dimensional structure such as a hemisphere onto a two dimensional substrate in an outline pattern. The outline pattern typically serves as a perimeter of a sensor. After forming a sensor in the shape of the outline pattern, the two dimensional substrate is flexed to form a three dimensional sensor structure.