Curved Image Sensor Substrate via Pressing

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Solution Overview

Problem

Conventional methods for manufacturing curved CMOS image sensing elements require forming a through hole in the substrate for air extraction, making the process complex, costly, and prone to unstable support and deformation of the image sensing element.

Innovation Solution

The image sensing element is curved by pressing it onto a substrate with a protrusion portion, eliminating the need for a through hole and allowing the substrate to be integral and stable, with the arc surface directly supporting the element.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If a through hole is formed in the substrate for air extraction, then the image sensing element can be attached to the arc surface, but the manufacturing process becomes more complex and time-consuming

Engineering Contradiction:

Improveattachment of image sensing elementVSAvoidmanufacturing process

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent removes the through hole structure from the substrate, extracting the problematic element that caused manufacturing complexity. Instead of forming through holes for air extraction, the patent uses an integral substrate structure that eliminates this requirement entirely, thereby simplifying the manufacturing process while maintaining the attachment function.

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of creating holes in the substrate to enable attachment, the patent inverts the approach by making the substrate integral and solid, and achieving attachment through alternative means that do not require removing material from the substrate structure.

Inventive Principle:

Principle #13The other way round (Inversion)

2Reliability

If a through hole is formed in the substrate, then air can be extracted to attach the image sensing element, but the substrate structure becomes non-integral and cannot stably support the element

Engineering Contradiction:

Improveattachment of image sensing elementVSAvoidsubstrate structure

Core Design Contradiction:

ReliabilityVSStability of the object's composition

Solution Approach 1:

The patent segments the substrate into a support portion and an extension portion with different curvature radii. The support portion has a first curvature radius that provides stable support for the image sensing element, while the extension portion has a second curvature radius that extends outward. This segmentation allows the substrate to maintain structural integrity and stability while still achieving the desired attachment configuration.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different regions of the substrate are given different local properties: the support portion has a specific curvature radius optimized for supporting the image sensing element, while the extension portion has a different curvature radius for other functional requirements. This local differentiation ensures stable support where needed while maintaining overall substrate integrity.

Inventive Principle:

Principle #3Local quality

3Reliability

If a through hole is formed in the substrate, then the image sensing element can be attached, but the substrate cannot stably support the element causing unexpected deformation

Engineering Contradiction:

Improveattachment of image sensing elementVSAvoidpositioning accuracy of image sensing element

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The substrate is pre-formed with the appropriate curvature and support structure before the image sensing element is attached. The support portion is designed with the correct first curvature radius in advance, ensuring that when the element is attached, it is properly positioned and supported, preventing deformation and ensuring manufacturing precision.

Inventive Principle:

Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This simplifies the manufacturing process, reduces costs, and provides a stable support structure for the image sensing element, enhancing the structural integrity and reducing deformation risks.

Implementation Method 1

The image sensing element is pressed to the substrate by the protrusion portion of the pressing element, such that the image sensing element is curved to form at least one arc surface on the substrate

Methodology Applied

Scientific EffectMechanical Force: Mechanical Force

Data Source

PatentUS11508772B2Image sensor and manufacturing method thereof

Publication Date: 2022.11.22 IND TECH RES INST

AI summary

An image sensor including a substrate and an image sensing element is provided. The substrate has an arc surface. The image sensing element is disposed on the arc surface and curved to fit a contour of the arc surface. The image sensing element has a front surface and a rear surface opposite to the front surface and has at least one bonding wire, the bonding wire is connected between the front surface and the substrate, and the rear surface of the image sensing element directly contacts the arc surface. In addition, a manufacturing method of the image sensor is also provided.