Curved Image Sensor Wafer-Level Packaging
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Solution Overview
Problem
Conventional image sensors face challenges in achieving high productivity and miniaturization due to the need for field curvature correction, which complicates the packaging process and limits the reduction of sensor size.
Innovation Solution
A curved image sensor design featuring a supporting substrate, a bonding pattern, a sensing substrate with a curved surface, and a fixing pattern that forms a closed air cavity, along with a logic circuit layer and connectors, to improve productivity and integration while allowing for a smaller package size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a curved image sensor is used to correct field curvature, then image quality is improved, but device complexity and packaging difficulty increase
Solution Approach 1:
The patent applies curvature to the light receiving surface of the image sensor to match the curvature of the lens, thereby correcting field curvature aberrations and improving image quality across the entire field of view
Solution Approach 2:
The patent combines the curved light receiving surface formation with the wafer-level packaging process, integrating multiple functions into a single manufacturing step to reduce overall device complexity
2Ease of manufacture
If conventional packaging processes are used for curved image sensors, then manufacturing is simpler, but package size cannot be reduced
Solution Approach 1:
The patent performs the curving of the light receiving surface at the wafer level before final packaging, preparing the component in advance to enable subsequent miniaturization of the package structure
Solution Approach 2:
The patent implements a compact package structure where components are nested within each other, with the curved image sensor integrated into a minimized package footprint, achieving both ease of manufacture and size reduction
3Productivity
If wafer-level curving is performed before packaging, then productivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent employs parameter optimization in the wafer-level curving process, including temperature control and pressure management, to achieve precise curvature formation while maintaining high manufacturing efficiency
Solution Approach 2:
The patent replaces complex mechanical curving methods with a controlled process that uses environmental parameters (temperature, pressure) to induce curving, thereby improving both precision and productivity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The curved image sensor significantly enhances productivity and reduces package size, improving operation speed and integration by forming the curved light receiving surface at the wafer level before packaging, thus addressing the limitations of conventional image sensors.
Implementation Method 1
The closed air cavity may have a lower pressure than the outside of the curved image sensor
Implementation Method 2
a bonding pattern provided over the supporting substrate... a fixing pattern provided over the supporting substrate and surrounding the periphery of the sensing substrate
Data Source
AI summary
A curved image sensor includes a supporting substrate, a bonding pattern provided over the supporting substrate a sensing substrate provided over the supporting substrate and in contact with the bonding pattern, and having a curved surface receiving incident light, and a fixing pattern provided over the supporting substrate and surrounding a periphery of the sensing substrate.