Curved Inner Spacer Profile for Nanosheet Gate Isolation

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Solution Overview

Problem

Existing integrated circuit (IC) fabrication methods struggle to achieve robust gate-to-source/drain isolation in gate-all-around devices due to limitations in spacer profiles.

Innovation Solution

The method involves forming nanosheets separated by inner spacers with a curved portion, followed by the formation of source/drain regions and gate material around the nanosheets to enhance spacer profiles and isolation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional planar FET structures are used, then manufacturing simplicity is maintained, but gate-to-source/drain isolation is insufficient

Engineering Contradiction:
Improvegate-to-source/drain isolationVSAvoiddevice structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The inner spacer is formed with a curved portion at its end adjacent to the gate material, replacing conventional straight spacer structures. This curvature enables the spacer to conformally contact the gate material and nanosheet interface, achieving robust gate-to-source/drain isolation while maintaining manufacturing feasibility through standard deposition and etching processes.

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Reliability

If gate-all-around structure is implemented, then electrostatic control is improved, but spacer profile formation becomes difficult

Engineering Contradiction:
Improveelectrostatic controlVSAvoidspacer profile
Core Design Contradiction:
ReliabilityVSManufacturing precision

Solution Approach 1:

The curved portion of the inner spacer is specifically designed to match the geometry of the gate-all-around structure. This curvature allows the spacer to form a precise conformal interface with both the gate material and nanosheet, enabling accurate spacer profile formation that supports the three-dimensional gate structure while maintaining manufacturing precision.

Inventive Principle:
Principle #14Spheroidality (Curvature)

Solution Approach 2:

The inner spacer exhibits different geometries at different locations: a curved portion at the end adjacent to the gate material for precise interface contact, and a substantially straight portion extending toward the source/drain regions for stable structural support. This local variation in geometry optimizes both electrostatic control and manufacturing precision in different functional regions.

Inventive Principle:
Principle #3Local quality

3Reliability

If inner spacers with curved portions are formed, then gate-to-source/drain isolation is enhanced, but manufacturing complexity increases

Engineering Contradiction:
Improvegate-to-source/drain isolationVSAvoidspacer fabrication
Core Design Contradiction:
ReliabilityVSEase of manufacture

Solution Approach 1:

The curved portion of the inner spacer is formed during the spacer deposition process itself, before subsequent gate material deposition. This preliminary formation of the curved geometry allows the spacer to serve as a template that guides subsequent processing steps, simplifying overall manufacturing by integrating the complex geometry creation into an early process step rather than requiring additional post-processing operations.

Inventive Principle:
Principle #10Preliminary action

Data Source

PatentUS20250133799A1Inner spacer having a curved portion
Publication Date: 2025.04.24 INTERNATIONAL BUSINESS MACHINE CORPORATION
  • US20250133799A1 patent drawing
  • US20250133799A1 patent drawing
  • US20250133799A1 patent drawing

AI summary

Embodiments of the invention include a semiconductor structure having nanosheets separated by inner spacers, the inner spacers having a curved portion in a dimension. The semiconductor structure includes source/drain regions formed adjacent to the nanosheets and gate material formed on the nanosheets.