Curved Interconnection Members for Flexible Semiconductor Packages

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Solution Overview

Problem

Existing semiconductor packages face challenges in maintaining electrical connectivity when subjected to external forces, particularly in flexible and portable electronic systems where substrates may warp or bend, leading to detachment of interconnection members and loss of connection.

Innovation Solution

The semiconductor package employs interconnection members with curved and hook surfaces, along with a flexible buffer layer, to maintain electrical contact between substrates even when external forces cause them to move or bend, ensuring continuous connectivity through the interaction of these members' surfaces and the buffer layer's flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If rigid interconnection structures are used to maintain electrical connectivity, then electrical connection reliability is improved, but flexibility and adaptability to warpage are worsened

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidflexibility to warpage

Core Design Contradiction:

ReliabilityVSAdaptability or versatility

Solution Approach 1:

The interconnection member includes a curved surface portion that is concavely bent, allowing the structure to flex and adapt to warpage while maintaining electrical contact. The curvature enables the rigid interconnection to bend with the substrate without breaking, resolving the contradiction between rigidity for reliability and flexibility for adaptability.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The interconnection member is designed with dynamic characteristics, including a bending portion that can deform under external forces and a hook surface that maintains contact through elastic deformation. This dynamic design allows the interconnection to adapt to changing shapes while preserving electrical connectivity.

Inventive Principle:

Principle #15Dynamics

2Adaptability or versatility

If flexible buffer layers are added to accommodate warpage, then flexibility is improved, but device complexity increases

Engineering Contradiction:

ImproveflexibilityVSAvoidstructure complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

A flexible buffer layer is introduced between the substrates to accommodate warpage and external forces. This thin flexible film provides the necessary flexibility without requiring complex mechanical structures, thus improving flexibility while minimizing the increase in device complexity.

Inventive Principle:

Principle #30Flexible shells and thin films

Solution Approach 2:

The flexible buffer layer acts as an intermediary element between the first and second substrates, absorbing mechanical stresses and allowing the substrates to move relative to each other while maintaining electrical connections through the interconnection members.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If interconnection members with curved surfaces are used to maintain contact during bending, then electrical connectivity under stress is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improveelectrical connectivity under stressVSAvoidcurved surface precision

Core Design Contradiction:

ReliabilityVSManufacturing precision

Solution Approach 1:

The curved surface portion of the interconnection member is designed with specific geometric characteristics that facilitate bending while maintaining contact. The curvature radius and shape are optimized to balance manufacturing feasibility with the ability to maintain electrical connectivity under stress.

Inventive Principle:

Principle #14Spheroidality (Curvature)

Solution Approach 2:

The interconnection member includes a bending portion designed in advance to deform elastically under expected external forces, preventing loss of electrical contact before it occurs. This pre-designed deformation capability cushions against the precision requirements by allowing controlled flexibility.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration allows for flexible semiconductor packages that maintain electrical connections under external forces, preventing detachment and ensuring reliable operation in warped or bent conditions.

Implementation Method 1

a first curved surface extending from the first pillar portion to be concavely bent... a second curved surface extending from the second pillar portion to be concavely bent

Methodology Applied

Scientific EffectElastic deformation: Elasticity

Data Source

PatentUS9668344B2Semiconductor packages having interconnection members

Publication Date: 2017.05.30 SK HYNIX INC

AI summary

A semiconductor package may include a first substrate including a first connection portion disposed on a surface of the first substrate and a second substrate including a second connection portion disposed on a surface of the second substrate. The second substrate may be disposed over the first substrate and the second connection portion facing the first connection portion. A first connection loop portion may be provided to include an end connected to the first connection portion. A second connection loop portion may be provided to include one end connected to the second connection portion and the other end combined with the first connection loop portion.