Curved 3D Electronic Module Interconnections for RF Signal Integrity

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Solution Overview

Problem

Current 3D electronic modules with orthogonal interconnections suffer from signal integrity issues at radiofrequencies due to electron reflections at vertical connections, limiting their performance beyond 1 GHz.

Innovation Solution

The implementation of a 3D electronic module with interconnections featuring a curved trajectory for signal paths between horizontal and vertical conductors, where the horizontal conductor and vertical conductor form an electrical connection with non-zero curvature, preventing electron reflections and ensuring signal integrity.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If orthogonal interconnections are used in 3D electronic modules, then manufacturing is simplified and structural alignment is easier, but signal integrity deteriorates at radiofrequencies due to electron reflections

Engineering Contradiction:

Improveinterconnection manufacturingVSAvoidsignal integrity

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent applies curvature to the interconnection path between horizontal and vertical conductors. Instead of a straight orthogonal connection, the conductor is formed with a curved trajectory that tangentially joins the horizontal and vertical segments. This curvature eliminates the sharp 90° angle that causes electron reflections, thereby maintaining signal integrity at radiofrequencies while preserving manufacturing simplicity.

Inventive Principle:

Principle #14Spheroidality (Curvature)

2Volume of moving object

If vertical conductors are connected perpendicular to horizontal conductors, then 3D stacking is achieved with compact footprint, but signal reflections occur at connection points

Engineering Contradiction:

Improvemodule footprintVSAvoidelectron reflections

Core Design Contradiction:

Volume of moving objectVSObject-generated harmful factors

Solution Approach 1:

The curved interconnection path replaces the perpendicular junction between horizontal and vertical conductors. The curve is designed to be tangent to both conductor segments, eliminating the sharp angle that generates electron reflections. This maintains the compact 3D stacking architecture while removing the harmful reflection effect.

Inventive Principle:

Principle #14Spheroidality (Curvature)

3Reliability

If curved interconnection paths are used, then signal integrity is improved by reducing reflections, but manufacturing complexity increases

Engineering Contradiction:

Improvesignal integrityVSAvoidinterconnection geometry

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent changes the geometric parameter of the conductor from a straight orthogonal path to a curved path with specific tangential properties. This parameter change improves signal integrity by eliminating reflections. The complexity is managed by defining the curve through standard manufacturing processes such as photoetching or electroplating, where the curved path can be defined by simple geometric parameters rather than complex multi-step fabrication.

Inventive Principle:

Principle #35Parameter changes

Data Source

PatentUS11587911B2Process for producing a high-frequency-compatible electronic module

Publication Date: 2023.02.21 3D PLUS CO

AI summary

The field of the invention is that of producing 3D electronic modules, compatible with components operating beyond 1 GHz. The invention relates to a 3D electronic module featuring an interconnection between a horizontal conductor and a vertical conductor to which it is connected exhibits, in a vertical plane, a non-zero curvature. It also relates to the associated production process.