Curved Interposer Sidewalls for Crack Prevention in Semiconductor Packages
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Solution Overview
Problem
Semiconductor packages face challenges in maintaining reliability due to cracking issues in the lower portions of interposers and semiconductor chips, which can arise from the increasing size and functionality demands while reducing package thickness.
Innovation Solution
The semiconductor package design incorporates a curved surface shape for at least a partial portion of the sidewalls of the interposer and semiconductor chips to prevent cracking, enhancing reliability by distributing stress and improving structural integrity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the size of semiconductor chips and packages is increased to provide increased performance, then functionality and capacity are improved, but the thickness of packages increases and cracking issues arise in lower portions
Solution Approach 1:
The interposer is designed with a curved bottom surface instead of a flat surface. This curvature distributes stress more evenly across the structure, preventing crack formation in the lower portions of the package while accommodating larger semiconductor chips and providing enhanced functionality.
2Adaptability or versatility
If multiple semiconductor chips are integrated into a single package to achieve high capacity and multi-functionality, then capacity and functionality are improved, but structural complexity increases and stress concentration occurs
Solution Approach 1:
The curved bottom surface of the interposer provides a streamlined structural solution that accommodates multiple semiconductor chips without creating stress concentration points. This geometric modification simplifies the overall structural design while enabling multi-chip integration for high capacity and multi-functionality.
3Length of stationary object
If package thickness is reduced for incorporation into thin electronic devices, then device thinness is improved, but stress concentration increases leading to cracking in lower portions
Solution Approach 1:
By forming the bottom surface of the interposer with a curved profile, stress is distributed more effectively throughout the thinned package structure. This prevents stress concentration at the lower portions that would otherwise lead to cracking, enabling reduced package thickness while maintaining reliability.
Data Source
AI summary
A semiconductor package includes a substrate. A first semiconductor chip is disposed on the substrate and is electrically connected to the substrate. The first semiconductor chip comprises a first sidewall extending in a first direction, a second sidewall extending in a second direction that crosses the first direction, and a third sidewall disposed between the first sidewall and the second sidewall and configured to connect the first sidewall and the second sidewall. The third sidewall has a curved surface shape. A second semiconductor chip is disposed on the first semiconductor chip and is electrically connected to the first semiconductor chip.