Curved Jaw Wire Bonding Tool to Reduce Substrate Damage
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Solution Overview
Problem
Wire bonding tools in the art cause involuntary damage and defective bonds, affecting bonding wires, bonding surfaces, and substrates, such as semiconductor substrates, due to issues like cratering, metal lift-off, and electrical failures.
Innovation Solution
A wire bonding tool with a customized groove geometry and curved jaws to accommodate the bonding wire, featuring a smooth transition and adjustable contact point, reducing mechanical stress and preventing damage during the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional wire bonding tools with flat jaws are used, then the bonding process can be completed, but substrate damage occurs (cratering, metal lift-off, tool-substrate-contact)
Solution Approach 1:
The patent applies curvature to the tip surfaces of the bonding tool jaws, replacing conventional flat surfaces with curved surfaces that have a radius of curvature R. This curvature distributes the bonding force over a larger area, preventing concentrated stress that causes substrate damage such as cratering and metal lift-off, while maintaining effective bond formation.
Solution Approach 2:
The patent modifies only the local geometry of the jaw tip surfaces while keeping the rest of the bonding tool structure conventional. The curved tip surfaces are specifically designed with particular radius of curvature values optimized for the bonding process, allowing localized improvement without redesigning the entire tool.
2Object-affected harmful factors
If bond parameters are reduced to prevent substrate damage, then substrate damage is minimized, but lift-off occurs
Solution Approach 1:
The curved tip surfaces with optimized radius of curvature R enable the tool to maintain higher bonding forces without causing substrate damage. The curvature distributes stress evenly, allowing sufficient force to prevent lift-off while avoiding the concentrated stress that would cause cratering or metal lift-off.
Data Source
AI summary
A wire bonding tool is disclosed. In one example, the wire bonding tool includes a groove for accommodating a bonding wire, and a pair of jaws defining side walls of the groove. Each jaw of the pair of jaws has a tip surface configured to face a bonding surface during operation. The tip surface of each jaw is curved.