3D Curved Laminated Substrate Forming with Elastic Sheet and Mold
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current methods for manufacturing three-dimensional (3D) curved electronic devices face challenges in forming uniform conductive layers on curved substrates, leading to issues with cracking, strain, and increased costs due to the brittleness of inorganic oxides and the need for specialized equipment.
Innovation Solution
A method and apparatus that use a laminated substrate with a thermoplastic resin support and an elastic sheet to deform and mold the substrate into a 3D curved shape, reducing strain and cracking by using a temperature-controlled mold and elastic sheet to soften and shape the resin substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a 3D curved substrate is prepared in advance and a conductive layer is formed on its surface, then the substrate can be lightweight and difficult to break, but it is difficult to form a uniform film on the curved substrate and bonding between curved substrates becomes difficult
Solution Approach 1:
The conductive layer and functional layers are formed on a flat substrate in advance before the substrate is processed into a 3D curved shape. This preliminary formation of layers on a flat surface ensures uniform film quality and proper bonding, while the final curved shape provides the desired durability and lightweight properties.
2Weight of moving object
If a conductive layer of inorganic oxide is processed into a 3D curved surface shape, then the substrate can be lightweight, but the conductive layer easily breaks due to its brittleness and large Young's modulus
Solution Approach 1:
The substrate undergoes controlled heating to change its physical parameters, making it pliable during the 3D shaping process. This temporary parameter change allows the brittle inorganic oxide conductive layer to be formed into a curved shape without cracking, while the substrate returns to its rigid state after cooling to provide the desired weight reduction and structural integrity.
3Ease of manufacture
If conventional film forming apparatus for flat substrates is used for 3D curved substrates, then equipment cost can be reduced, but the apparatus cannot be used as-is for curved substrates requiring specialized equipment
Solution Approach 1:
The conductive layer and functional layers are formed on a flat substrate in advance using conventional film forming apparatus designed for flat surfaces. After the layers are properly formed with uniform quality, the entire laminated substrate is then processed into a 3D curved shape, allowing the use of standard equipment while achieving curved substrate functionality.
4Shape
If the substrate is processed to have a three-dimensional shape after forming functional layers, then the device can achieve desired design and fitting, but strain generated in the conductive layer propagates to the functional layer causing large strain and performance variation
Solution Approach 1:
The substrate is heated to change its physical parameters, making it pliable during the 3D shaping process. This controlled parameter change allows the substrate to be formed into the desired curved shape while minimizing strain propagation to the functional layers. After cooling, the substrate returns to its rigid state, maintaining the functional layers' performance uniformity while achieving the desired design flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The approach enhances the reliability and durability of 3D curved electronic devices while maintaining transparency and conductivity, suppressing cracks and strain, and reducing production costs by using conventional bonding apparatuses for flat substrates.
Implementation Method 1
The laminated substrate is brought into close contact with a temperature-controlled mold to soften the resin substrate
Implementation Method 2
The elastic sheet is deformed while the laminated substrate is in close contact with the elastic sheet
Data Source
AI summary
A method for forming a three-dimensional curved surface on a laminated substrate is provided. In the method, the laminated substrate is brought into close contact with an elastic sheet. Here, the laminated substrate comprises a support substrate and a conductive layer on the support substrate, and the support substrate comprises a resin substrate comprising a thermoplastic resin. The elastic sheet is deformed while the laminated substrate is in close contact with the elastic sheet. The laminated substrate is brought into close contact with a temperature-controlled mold to soften the resin substrate.