Curved Surface Lamination Device for Flexible Panels
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing curved surface lamination technologies face issues with insufficient stiffness in roller schemes and uncontrolled local lamination stress in silicon substrate schemes, leading to stress concentration and lamination failures, particularly at the four corners and middle area.
Innovation Solution
A curved surface lamination apparatus comprising a profiling jig with a base and profiling portion, and a lower jig with a sinking groove, which encloses a hollow structure to distribute external pressure uniformly across the profiling portion, ensuring even stress distribution on the flexible panel and preventing stress concentration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If roller scheme is used for curved surface lamination, then the lamination process can be performed, but the stiffness is insufficient leading to lamination failures
Solution Approach 1:
The patent employs a curved surface lamination apparatus with a specifically designed curved lamination surface that matches the curvature of the display panel. This curved geometry provides the necessary stiffness and structural support during the lamination process, eliminating the insufficiency of roller schemes while maintaining reliability and preventing lamination failures.
2Stress or pressure
If silicon substrate scheme is used for curved surface lamination, then the lamination process can be performed, but the local lamination stress is uncontrolled causing stress concentration
Solution Approach 1:
The patent implements a pressure applying mechanism that can independently control and adjust pressure at different locations on the lamination surface. This local quality control ensures uniform stress distribution across the entire curved surface, preventing stress concentration at specific points and thereby improving lamination reliability while maintaining controlled stress levels.
3Force
If high device loads are applied to achieve lamination, then the lamination can be completed, but the stress concentration causes lamination failures
Solution Approach 1:
The curved lamination surface structure distributes the applied device load evenly across the entire lamination area through its geometric configuration. This curvature-based load distribution prevents stress concentration that would otherwise occur with flat or roller-based systems, enabling lamination completion at lower, safer force levels while maintaining high reliability and preventing failures.
Data Source
AI summary
A curved surface lamination device, comprising a profiling jig (01), the profiling jig (01) comprising a base (101) and a profiling portion (102), with the profiling portion (102) being configured to support a carrier film (02), and the side of the base (101) facing away from the profiling portion (102) being provided with an opening; and a lower jig (03), comprising a first sinking groove (301), with part of the base (101) being inserted into the first sinking groove (301), such that the lower jig (03) encloses a hollow structure (E) with the base (101) at the opening position.